| XIE Gui-lan,XIAO Fang-yu,GONG Shu-guang,HOU Kun,SONG Mu-qing,ZUO Li-lai.Numerical Analysis of the Effect of Substrate Surface Roughness on the Process of Cold Spray Particle Deposition Based on the Material Point Method[J],52(5):405-412 |
| Numerical Analysis of the Effect of Substrate Surface Roughness on the Process of Cold Spray Particle Deposition Based on the Material Point Method |
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| DOI：10.16490/j.cnki.issn.1001-3660.2023.05.040 |
| KeyWord:cold spray material point method surface roughness deformation behavior bonding mechanism |
| Author | Institution |
| XIE Gui-lan |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
| XIAO Fang-yu |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
| GONG Shu-guang |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
| HOU Kun |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
| SONG Mu-qing |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
| ZUO Li-lai |
School of Mechanical Engineering and Mechanics, Xiangtan University, Hunan Xiangtan , China |
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| Abstract: |
| The work aims to solve the problem of grid distortion in simulation of the cold spray particle deposition by the finite element method and discuss the bonding method of particles and rough substrate. The simulation model of cold spray particle deposition was established based on the material point method. The effect of surface roughness on particle deposition and the deformation behavior of particle deposition at different locations were discussed. The process of cold spray copper substrates with copper particles was simulated and analyzed by the program written in FORTRAN language. At the same time, the simulation results of the residual height and surface morphology of the particles were compared with the experimental results in the literature. The material point method was feasible and effective for simulating the cold spray particle deposition process. With the deposition of particles at the wave crest as an example, the effect of surface roughness on particle deposition was analyzed, and the bonding mechanism of particles deposited at different locations on the substrate surface was discussed. Under the action of the convex structure on the wave crest, with the increase of surface roughness, the jet became longer and had a development trend from top to bottom, the flattening trend of particles increased, the degree of deformation increased, and the kinetic energy of rebound decreased. When the surface roughness was large enough, the particle jet contacted the wave crests on both sides, which might form a mechanical occlusal structure. When the particles were deposited at the trough, they were difficult to be flattened by the wave crests on both sides, and the degree of deformation was reduced. When the wave crest height was large enough, the deformation degree of the particle and the substrate decreased, but the depth of the pit had a tendency to increase after deposition, the kinetic energy of rebound had a tendency to decrease, and the degree of bonding of the particle and substrate was improved. When the particle was deposited at the half waist, there was a certain angle between the particle velocity direction and the contact of the normal line. Under the action of the tangential velocity component, the particles tended to slip to the right and form secondary contact with the right wave crest, resulting in a longer jet. When the height of the crest increased, the jet became longer, the secondary contact strength of the particle and the right wave peak increased, and the bonding strength at this point increased. The bonding strength between the particles and the substrate increases as the surface roughness increases, and the particles can form a mechanical occlusal structure at the crest of the wave. The depth of the pit increases and the kinetic energy of rebound decreases at the trough, which plays a filling role. At the half waist, secondary contact is generated, which increases the bonding strength between the particles and substrate. The study results provide some guidance for the production of cold spray process. |
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