| CHEN Bing,LI Shun-shun,LIU Guo-yue,HE Xin.Grinding Removal Mechanism of Tungsten Alloy[J],52(4):304-318 |
| Grinding Removal Mechanism of Tungsten Alloy |
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| DOI：10.16490/j.cnki.issn.1001-3660.2023.04.027 |
| KeyWord:tungsten alloy single abrasive grain scratching finite element removal characteristics grinding mechanism |
| Author | Institution |
| CHEN Bing |
School of Mechanical Engineering,Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, Hunan University of Science and Technology, Hunan Xiangtan , China |
| LI Shun-shun |
School of Mechanical Engineering,Hunan Provincial Key Laboratory of High Efficiency and Precision Machining of Difficult-to-Cut Material, Hunan University of Science and Technology, Hunan Xiangtan , China |
| LIU Guo-yue |
Hunan Taijia New Material Technology Co., Ltd., Changsha , China |
| HE Xin |
iFLYTEK Suzhou Technology Co., Ltd., Jiangsu Suzhou , China |
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| Abstract: |
| The work aims to solve the problem that the removal mechanism of tungsten alloy is uncertainty in grinding process. The grinding removal characteristics of tungsten alloy in different scratching stages and different phases were explored based on the single abrasive scratching experiment. The grinding removal mechanism of tungsten alloy was explored by combining the finite element simulation of single abrasive scratching and grinding experiment of tungsten alloy. The results showed that there were significant differences in material removal characteristics at different positions of tungsten alloy scratches during the scratching process. In the finite element simulation of single abrasive rotary scratching tungsten alloy, elastic-plastic deformation of tungsten alloys could be observed at the cut-in zone. In the middle of the scratch, the mises stress inside the scratch increased along the scratching direction, the ridge height on both sides of the scratch increased, and the stress influence area expanded. At the cut-out zone, the scratch morphology was worse than at the cut-in zone. Plastic deformation, uplift, micro-cracks of the material, and then the mixing and blending of tungsten phase with binder phase could be observed in succession at the cut-in zone of single particle scratching, and it was about to enter the removal stage. In the middle of the scratch, the material was mainly removed, and the material micro-rolling and the material rolling could be observed in the scratch, and the material rolling was increasingly obvious along the scratching direction. Meantime, because of the different steepness of diamond abrasive tip, the material in the scratch upper part was consecutively removed, and the material micro-rolling and the material rolling was unconspicuous, while the material micro-rolling and the material rolling in the scratch lower part were obvious, and the stability of surface morphology in the scratch upper part was better than that in the scratch lower part. At the cut-out zone of the scratch, plastic deformation and a large amount of material rolling could be observed, the results showed the plowing stage and the material removal stage existed at the cut-out zone, and "flashing" phenomenon appearred at the edge and tail of the scratch. Compared with the cut-in zone, the scratch appearance was worse. Subsequently, the experimental phenomenon was consistent with that in the simulation. In addition, the material removal characteristics were also different at different phases. Brittle and plastic features could be observed in the tungsten phase region. For example, different shapes of abrasive chips were found in the tungsten phase region. The debris and chips of tungsten phase indicated that ductile and brittle removal of tungsten phase exist in grinding process. In the bonding phase region, the characteristics of plastic deformation and plastic flow were mainly exhibited when the scratch was shallow, and the mixing and blending with the tungsten phase was mainly exhibited when the scratch was deep at the middle part of it. In the mixing and blending area of bonding and tungsten phases, the fish-scale rolling of tungsten alloy was weaker than that in tungsten phase or the material rolling could not be observed so that the mixing and blending area of bonding and tungsten phase on the surface of tungsten alloy could get better surface quality, and even the bonding phase could reduce the cutting force during the removal process of tungsten alloy, which was positive to remove the material. It could be observed that adjacent tungsten particles had different damage or removal characteristics at the boundary between tungsten phase and bonding phase, and the phase boundary blocked the removal behavior. Finally, almost all the removal characteristics of single grain scratching were presented on the surface of the tungsten alloy by grinding, which was consistent with the removal features by scratching. There were brittle removal characteristics such as tungsten fracture, tungsten microcrack and material roll-up, as well as ductile removal characteristics such as tungsten plastic deformation, intermittent scratch edge uplift, mixing and blending of bonding phase and tungsten phase, so it could be seen that brittle and ductile removal were accompanied in the grinding process. What's different was that regional and radial cracks appeared at the bottom of the scratches by grinding. Therefore, the two-phase characteristics of tungsten alloys make the removal characteristics of the grinding surface complex with brittle and ductile removal characteristics such as plastic deformation, micro-cracks, micro-rolling, rolling, cracks and two-phase fusion existing together. The grinding removal mechanism of tungsten alloy is explored, which provides theoretical basis and technical support for efficient and precise grinding of tungsten alloy. |
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