| WANG Zhao-xin,REN Jian-hua,YAO Chuan-hui,YIN Guan-hua.Effects of Copper Sulfate Concentration and Current Density on FreeMicrobeads Assisted Grinding Electroformed Copper[J],52(1):401-409, 420 |
| Effects of Copper Sulfate Concentration and Current Density on FreeMicrobeads Assisted Grinding Electroformed Copper |
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| DOI：10.16490/j.cnki.issn.1001-3660.2023.01.041 |
| KeyWord:acid electroformed copper auxiliary grinding mass concentration of copper sulfate current density current efficiency surface topography microhardness |
| Author | Institution |
| WANG Zhao-xin |
School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China |
| REN Jian-hua |
School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China |
| YAO Chuan-hui |
School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China |
| YIN Guan-hua |
School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo , China |
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| Abstract: |
| The work aims to study the effects of copper sulfate concentration and current density on the surface morphology, microhardness and current efficiency of free microbeads assisted grinding electroformed copper deposition. The current density was increased from 1 A/dm2 to 4 A/dm2 for single factor electroformed copper test under the conditions of copper sulfate concentration of 40 g/L, 80 g/L and 120 g/L with a vertical cathode rotary electroforming equipment, including cathode movement and conductive part, anode hanger, free bead assisted grinding electroforming unit, electrodeposition unit, electroforming liquid circulation and temperature control system. The free bead assisted grinding electroforming unit was a circular cathode basket that limited the beads within a certain range. The inner side of the anode basket was close to the nylon yarn net to prevent the beads from leaking out. A coulomb meter was used to measure and record the amount of charge flowing through the test circuit. A precision electronic balance was used to measure the quality of the copper deposition layer. A scanning electron microscope was used to observe the surface microscopic morphology of the copper deposition layer. A microhardness tester was used to measure the microhardness of the copper deposited layer. A microhardness tester was used to measure the microhardness of the copper deposition. And a roughness measuring instrument was used to measure the surface roughness of the deposited layer. When the concentration of copper sulfate was 40 g/L and the current density increased from 1 A/dm2 to 4 A/dm2, the surface morphology of the electrodeposition gradually became smooth and flat. The current efficiency increased first and then decreased with the increase of current density. The current efficiency came up to the highest 95.4% at a current density of 2 A/dm2, and decreased to the lowest 92.7% at a current density of 4 A/dm2. When the current density increased from 1 A/dm2 to 3 A/dm2, the microhardness increased from 120.3HV to 139.8HV. The lowest surface roughness was Ra 0.19 μm at a current density of 4 A/dm2. When the concentration of copper sulfate was 80 g/L, and the current density increased to 4 A/dm2, the surface roughness of the electroformed layer was Ra 0.62 μm, the current efficiency and microhardness were the highest. The current efficiency increased from 94.1% to 97.2%, and the microhardness increased from 119.4HV to 146.3HV with the current density increasing from 1 A/dm2 to 4 A/dm2. When the concentration of copper sulfate was 120 g/L, the burrs on the surface of the electroformed layer became smaller and the number of burrs decreased gradually. The current efficiency increased from 93.9% to 97.6%, and the microhardness increased from 117.3HV to 136.4HV with current density increasing from 1 A/dm2 to 4 A/dm2. When the current density was 4 A/dm2, the burrs were the least and smaller, and the current efficiency and microhardness increased to the highest. The surface morphology and microhardness of the electroformed layer could be improved by increasing current density or decreasing the concentration of copper sulfate under certain conditions. The grinding of free microbeads can not only improve the surface morphology of the electroformed copper layer, but also improve the grain structure and microhardness of the electroformed copper layer. However, the movement of the microbeads will grind away trace amounts of copper from the surface of electroformed copper layer and reduces the current efficiency of copper electroforming. |
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