ZHU Zhi-cheng,YANG Zhao,PAN Bo,ZHANG Shuai-qi,YANG Zhong-xue,WANG Sai,ZHANG Chang-chun,GUO Jiang.Effect of Anisotropy on Surface Integrity of IC10 Superalloy after Grinding[J],52(1):222-231
Effect of Anisotropy on Surface Integrity of IC10 Superalloy after Grinding
  
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DOI:10.16490/j.cnki.issn.1001-3660.2023.01.023
KeyWord:IC10 single crystal superalloy  creep feed grinding  anisotropy  surface roughness  surface morphology  microhardness  plastic deformation layer
                       
AuthorInstitution
ZHU Zhi-cheng State Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of Technology, Liaoning Dalian , China
YANG Zhao Military Representative Office of Army Equipment Department in Beijing, Beijing , China
PAN Bo State Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of Technology, Liaoning Dalian , China
ZHANG Shuai-qi Beijing Institute of Aeronautical Materials,Key Laboratory of Advanced High Temperature Structural Materials,Beijing , China
YANG Zhong-xue Beijing Institute of Aeronautical Materials,Key Laboratory of Advanced High Temperature Structural Materials,Beijing , China
WANG Sai Beijing Institute of Aeronautical Materials,Key Laboratory of Advanced High Temperature Structural Materials,Beijing , China
ZHANG Chang-chun Institute of High Temperature Materials, Beijing , China
GUO Jiang State Key Laboratory of High-Performance Precision Manufacturing, Department of Mechanical Engineering, Dalian University of Technology, Liaoning Dalian , China
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Abstract:
      IC10 superalloy has been used to manufacture turbine blades of high thrust-to-weight ratio aero-engine due to its excellent properties such as small specific gravity, high strength and creep resistance under high-temperature environment. Creep feed grinding which has the characteristics of high efficiency and high precision is applied for precision machining after blade casting. Surface integrity after processing has an important impact on the fatigue life and service performance of the parts. Owing to the difficult-to-machine characteristics of superalloy, it is difficult to ensure the surface integrity of the workpiece after grinding. Specifically, surface integrity of single crystal superalloy is affected not only by the grinding process parameters, but also by anisotropy. Therefore, the work aims to systematically study the effect of the anisotropy of IC10 single crystal superalloy on the surface roughness, surface morphology, microhardness and plastic deformation layer after grinding and explore its engineering application. The sticks of IC10 single crystal superalloy were poured by the spiral crystal selection method and the directional solidification process. The stick of which growth direction from the [001] crystal orientation was 4.9° was selected (generally considered to be qualified within 8°), and then subject to solid solution process and the aging treatment. The workpieces with three typical crystal planes (001), (011) and (111) were cut by wire cutting, and the (001) crystal plane was selected to make metallographic samples to determine [100] and [010] crystal orientation according to dendrite direction. The workpieces with different crystal orientations were cut along the [100] crystal orientation every 15°. All workpieces were cut into 20 mm×10 mm×15 mm cuboid. Before the experiment, the surface of the workpieces was finely ground to remove the remelted layer caused by the wire cutting to ensure that workpieces were consistent. Creep feed grinding experiments were carried out along different crystal planes and different crystal directions under the same process parameter (grinding wheel linear speed of 20 m/s, workpiece feed speed of 150 mm/min, and grinding depth of 0.2 mm). The experimental equipment was a three-axis creep feed grinder (Chevalier FSG-B818CNC), the coolant was an emulsion (Basso) with a concentration of 3wt.%, and the grinding wheel was mixed abrasive grinding wheel with white corundum and chromium corundum (Norton WA/PA80-F25VCF2). The surface profiler (Talysurf CLI2000) was used to measure the surface roughness of the workpiece after grinding and the laser confocal microscope (OLYMPUS OLS5000) and the scanning electron microscope (ZEISS Sigma 300) were used to observe the surface morphology. The micro Vickers hardness tester (Qness) was used to test the microhardness, and the scanning electron microscope was used to observe the plastic deformation layer. The surface roughness Ra of different crystal planes after grinding was between 0.3-0.4 μm. The surface roughness Ra of (001) crystal plane after processing was 0.32 μm. The surface processing texture was uniform and the degree of contour fluctuation was minimal. The surface roughness Ra of (011) crystal surface after processing was 0.35 μm. The surface roughness Ra of (111) crystal plane after grinding was 0.39 μm, and deep furrows and pits appeared on the surface of the workpiece. The surface of different crystal planes hardened after processing, and the degree of hardening was (001), (011) and (111) from strong to weak. There was plastic deformation layer with micron-sized thickness under the grinding surface. The (111) crystal plane had the thickest plastic deformation layer at 3.6 μm, and the thickness of (011) and (001) crystal planes were respectively 2.8 μm and 2 μm. The surface roughness, surface morphology, microhardness and plastic deformation layer of (001) crystal plane with different crystal orientations after grinding did not show obvious regular changes. The anisotropy of IC10 single crystal superalloy has a certain effect on the surface integrity of workpiece after grinding. The surface integrity of different crystal planes after grinding changes regularly due to difference in plastic deformation of different crystal planes. The surface roughness of (001) crystal plane is the lowest after processing, the surface processing texture is the smoothest, the microhardness is the largest, and the thickness of plastic deformation layer is the smallest. However, the status of microstructure is randomly distributed such as circles, squares, triangles, etc., which results in no obvious regularity for the surface integrity of workpiece with different crystal orientations on the same crystal plane.
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