ZHAO Dan,SONG Hong-zhang,SUN Hong-wei,HU Xing,YANG De-lin.Study on the Preparation of Cu-coated SiC Particles by Electroless Plating[J],(3):105-108,129
Study on the Preparation of Cu-coated SiC Particles by Electroless Plating
Received:February 10, 2012  Revised:June 20, 2012
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KeyWord:electroless copper plating  SiC particals  pretreatment  plating speed  copper content
              
AuthorInstitution
ZHAO Dan Physicl and Engineering College, Zhengzhou University, Zhengzhou , China
SONG Hong-zhang Physicl and Engineering College, Zhengzhou University, Zhengzhou , China
SUN Hong-wei Physicl and Engineering College, Zhengzhou University, Zhengzhou , China
HU Xing Physicl and Engineering College, Zhengzhou University, Zhengzhou , China
YANG De-lin Physicl and Engineering College, Zhengzhou University, Zhengzhou , China
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Abstract:
      Copper coated SiC particles were prepared by the electroless plating method. The influence of pretreatment, the plating solution component, the pH value and loadage on the Cu layer were analyzed. Furthermore, the effects of adjusting the content of sulfate and the loadage on controlling the copper content in the composite powder were compared .The phase, morphology and component of powder were analyzed with XRD,SEM and EDS to obtain the optimum plating process. The results show that the uniform Cu coat can be obtained only when the activating solution for pretreatment deposited for some time; Along with the pH value and the sulfate content increases, the speed of plating increases, but the cladding perfection and uniformity of powder reduces; Adjusting the loadage is a better way to control the content of copper in composite powder.
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