WANG Shan-shan,ZHU Yao-min,REN Feng-zhang,YIN Li-tao.Effect of Plating Process on the Microstructure and Hardness of Ni Nano-films[J],39(2):52-54
Effect of Plating Process on the Microstructure and Hardness of Ni Nano-films
  Revised:April 10, 2010
View Full Text  View/Add Comment  Download reader
DOI:
KeyWord:nanocrystalline Ni film  additive  hardness  microstructure  texture
           
AuthorInstitution
WANG Shan-shan Henan University of Science and Technology, Luoyang , China
ZHU Yao-min Henan University of Science and Technology, Luoyang , China
REN Feng-zhang 1.Henan University of Science and Technology, Luoyang , China;2.Henan Key Laboratory of Advanced Non-ferrous Metals, Luoyang , China
YIN Li-tao Henan University of Science and Technology, Luoyang , China
Hits:
Download times:
Abstract:
      Ni nano-films were obtained by direct current electrodeposition. The effect of C12H24NaSO4, TJ and GL-100 on coating of micro-surface morphology, hardness, grain size and texture, and the relation of between current density and hardness were studied. The results indicate that the growth rate and direction of the crystal surface are changed, and the crystal plane(200)is occurred texture when the electro-bath is absence of additives or only join C12H24 NaSO4.The addition of TJ make the grain significant refainment. The coating grains prefer to grow with orientation in the crystal plane(111)when TJ and GL-100 are added in the electro-bath.Surface morphology and hardness of the coating achieve the best condition with adding three kinds of additives. On the same plating conditions, the coating hardness increases with the increasement of current density.
Close