| HU Li-xin,ZHAN Wen,KOU Zhi-min,WU Rui-huang,OU Yang-gui.Study on Electroless Silver Plating on PCB[J],37(5):45-48 |
| Study on Electroless Silver Plating on PCB |
| Received:June 23, 2008 Revised:October 10, 2008 |
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| DOI： |
| KeyWord:PCB Electroless silver plating Methane Suhonic acid Atomic force microscopy Quality testing |
| Author | Institution |
| HU Li-xin |
School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan , China |
| ZHAN Wen |
School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan , China |
| KOU Zhi-min |
School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan , China |
| WU Rui-huang |
School of Chemical and Environmental Engineering, Hubei University of Technology, Wuhan , China |
| OU Yang-gui |
Wuhan Research Institute of Materials Protection, Wuhan , China |
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| Abstract: |
| It's researched that methane sulfonic acid was used to be a acid system at electroless silver plating. Main salt, some additives and correlative technics which could affect the thickness and quality of plating surface were investigated. The result shows that the plating surface obtainted at AgN03 2. 5g/L, methane sulfonic acid 12% ( wt) , reaction time Smin and so on, of which the thickness was up t0 0.16μm, is symmetrical and silvery white. The process can apply at weld which is a procedure on PCB. Furthermore, some factors which may affect the quality of plating surface were discusseed by characterizing of surface appearance with atomic force rmcroscopy ( AFM) . |
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