| WU Hua-bo,WANG Zhi-fa,LIU Jin-wen,CUI Da-tia,JIANG Guo-sheng,ZHOU Jun.Analysis and Treatment of Nickel-plating Layer Defects on the W/Cu Composites[J],37(3):80-83 |
| Analysis and Treatment of Nickel-plating Layer Defects on the W/Cu Composites |
| Received:January 10, 2008 Revised:June 10, 2008 |
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| DOI： |
| KeyWord:W/Cu composites Defect analysis Hole Stain, Bubbling Erosion |
| Author | Institution |
| WU Hua-bo |
Material College of Central South University, Changsha , China |
| WANG Zhi-fa |
Material College of Central South University, Changsha , China |
| LIU Jin-wen |
Material College of Central South University, Changsha , China |
| CUI Da-tia |
Material College of Central South University, Changsha , China |
| JIANG Guo-sheng |
Material College of Central South University, Changsha , China |
| ZHOU Jun |
Material College of Central South University, Changsha , China |
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| Abstract: |
| The common defects of nickel-plating layer on the W/Cu composites were studied, including hole, stain, bubbling and erosion. The morphologies of those defects were mvestigated by SEM and Metallograph; the elements in those defects were determined by EDS. The results indicate that holes in nickel-plating layer are due to the big holes in the matrix of W/Cu composites, electroplating bath left in the pinhole of the surface of W/Cu composites is the major reason for the stain, bubbling is induced by the Al203 in the surface of the matrix, and the erosion is due to the inappropriate electroplating process. The relative technical treatment for the different defects was also given. |
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