| CHEN Wen-ming,ZENG Wei-min,MA Yu-Lu.Research on Pore Sealing of Electroless Ni-P Plating Alloy Covered with Silane Film[J],37(3):4-5,8 |
| Research on Pore Sealing of Electroless Ni-P Plating Alloy Covered with Silane Film |
| Received:January 23, 2008 Revised:June 10, 2008 |
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| DOI： |
| KeyWord:Silane films Electroless Ni-P Plating Alloy Anticorrosion Chemical plating Electroless Ni-P plating alloy Sealing |
| Author | Institution |
| CHEN Wen-ming |
Key Laboratory of Safety Science of Pressurized System, Ministry of Education, School of Mechanical Engineering,East China University of Science and Technology, Shanghai , China |
| ZENG Wei-min |
Key Laboratory of Safety Science of Pressurized System, Ministry of Education, School of Mechanical Engineering,East China University of Science and Technology, Shanghai , China |
| MA Yu-Lu |
Key Laboratory of Safety Science of Pressurized System, Ministry of Education, School of Mechanical Engineering,East China University of Science and Technology, Shanghai , China |
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| Abstract: |
| It is inevitable to form pore in the process of electroless Ni-P plating alloy, Ni-P plating alloy on the surface of steel belongs to cathode anticorrosion plating in mostly corrosion mediums, pore conduces steel hole corrosion. The silane film was used to seal porosity in electroless Ni-P plating alloy. The results show that the anticorrosion of electroless plating is improved dramatically after the plating covered with silane films. |
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