| WEI Zhe-liang.Effect of Ethylenediamine on Immersion Silver Plating on Copper Substrate[J],37(2):31-33 |
| Effect of Ethylenediamine on Immersion Silver Plating on Copper Substrate |
| Received:October 10, 2007 Revised:April 10, 2008 |
| View Full Text View/Add Comment Download reader |
| DOI： |
| KeyWord:Immersion silver Ligand Ethylenediamine Displacement |
| Author | Institution |
| WEI Zhe-liang |
College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou , China |
|
| Hits: |
| Download times: |
| Abstract: |
| To avoid getting loose immersion silver plating on copper substrate in simple silver salt solution, the effects of ethylenediamine on silver deposition rate, deposition process and finishing appearance were studied by capacity titration, electrochemical method and FE-SEM. The results show that as a ligand, ethylenediamine not only can slow down the silver deposition rate, but also make the adhered silver atoms grow up along the surface of copper substrate, and so a smooth and dense silver coating is obtained. |
| Close |
|
|
|