| HU Shi-ju,SHI Hai-fang,LI zhi_chao.The study on Microstructures and Properties of Solid Solution and Aging Heat Treated after Deeply Aluminized Copper[J],37(1):48-50 |
| The study on Microstructures and Properties of Solid Solution and Aging Heat Treated after Deeply Aluminized Copper |
| Received:October 11, 2007 Revised:February 10, 2008 |
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| DOI： |
| KeyWord:Deeply aluminizing Solid solution and aging heat treatment Wear resistance Thermal fatigue |
| Author | Institution |
| HU Shi-ju |
Fuxin Campus of Liaoning Radio and TV University, Fuxin , China |
| SHI Hai-fang |
Department of Materials Science and Engineering, Liaoning Technical University, Fuxin , China |
| LI zhi_chao |
Department of Materials Science and Engineering, Liaoning Technical University, Fuxin , China |
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| Abstract: |
| In order to improve the wear resistance and thermal fatigue resistance of metallurgical equipment copper heat transfer components, the pure copper samples were solid solution treated at 925℃ for l. 5 hours and aging heat treated at 300℃ for 3 hours after deeply aluminized at 925 ℃ for 12 hours. The microstructures and properties of the samples were studied. The results show that the microstructure of the solid solution and aging heat treated after deeply aluminized copper surface is β' , the abrasive wear resistance and adhesive wear resistance of solid solution and aging heat treated sample are the 2. 12 times and 22. 59 times of that of the pure copper sample respectively. The ratio of weightlessness of the thermal fatigue sample subjected to solid solution and aging heat treatment is 9 percents of that of pure copper sample after heated at 930℃ and cooled for 250 times. |
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