董迎港,任建华,周超,尹冠华,姚传慧.脉冲参数对微珠自适应辅助磨脉冲电铸镍性能的影响[J].表面技术,2025,54(10):246-255.
DONG Yinggang,REN Jianhua,ZHOU Chao,YIN Guanhua,YAO Chuanhui.Effect of Pulse Parameters on Properties of Pulse Electroforming Nickel by Microbead Adaptive Assisted Grinding[J].Surface Technology,2025,54(10):246-255
脉冲参数对微珠自适应辅助磨脉冲电铸镍性能的影响
Effect of Pulse Parameters on Properties of Pulse Electroforming Nickel by Microbead Adaptive Assisted Grinding
投稿时间:2024-08-05  修订日期:2025-01-11
DOI:10.16490/j.cnki.issn.1001-3660.2025.10.020
中文关键词:  微珠自适应辅助磨  占空比  脉冲频率  脉冲电铸    柔性支撑  表面质量
英文关键词:microbead adaptive assisted grinding  duty cycle  pulse frequency  pulse electroforming  nickel  flexible support  surface quality
基金项目:国家自然科学基金青年基金(51805302)
作者单位
董迎港 山东理工大学 机械工程学院,山东 淄博 255000 
任建华 山东理工大学 机械工程学院,山东 淄博 255000 
周超 山东理工大学 机械工程学院,山东 淄博 255000 
尹冠华 山东理工大学 机械工程学院,山东 淄博 255000 
姚传慧 山东理工大学 机械工程学院,山东 淄博 255000 
AuthorInstitution
DONG Yinggang School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo 255000, China 
REN Jianhua School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo 255000, China 
ZHOU Chao School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo 255000, China 
YIN Guanhua School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo 255000, China 
YAO Chuanhui School of Mechanical Engineering, Shandong University of Technology, Shandong Zibo 255000, China 
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中文摘要:
      目的 为提高电铸镍性能,提出一种微珠自适应辅助磨脉冲电铸工艺。方法 在柔性介质和阴极芯模间填充适量微珠,使其持续摩擦阴极表面,结合脉冲电源获得高性能镍沉积层。对比研究传统电铸与本工艺的电铸镍层性能差异,探讨脉冲参数对微珠自适应辅助磨脉冲电铸工艺所得镍层的影响,通过设置不同脉冲频率与占空比分别进行电铸试验,分析其对电铸层表面微观形貌、显微硬度以及表面粗糙度等的作用。结果 结果表明:微珠自适应辅助磨脉冲电铸工艺较传统电铸提升了电铸层性能。脉冲频率提升时,电铸层性能明显改善,但脉冲频率提升至1 000 Hz后,沉积层性能提升幅度趋缓。而占空比对沉积层的性能影响更为显著:20%占空比相较于80%占空比,镍层的表面粗糙度(Ra)值降低约52.5%,显微硬度值高14.12%,平均晶粒尺寸小53.6%,XRD结果显示电铸层(111)晶面的衍射强度最强,(200)晶面的衍射强度最弱,且二者的衍射强度差距最小,晶粒择优取向最佳。当其他条件不变,随着占空比逐渐增加,电铸层的晶粒逐渐粗大,显微硬度、表面粗糙度和晶粒择优取向渐劣。结论 结果表明,微珠自适应辅助磨脉冲电铸工艺可提升电铸镍层性能,工艺中采用较大脉冲频率可以细化晶粒、去除缺陷,继续增大脉冲频率对沉积层的性能影响逐渐趋于微弱。较低占空比的脉冲电源有利于提升该工艺细化晶粒及去除缺陷的作用。
英文摘要:
      In order to improve the performance of electroforming nickel, a microbead adaptive grinding pulse electroforming process was proposed. An appropriate amount of microbeads were filled between the flexible medium and the cathode core mold, and the surface of the cathode was continuously rubbed with microbeads. Combined with the pulse power supply, more growth activation points were generated on the surface of the electroforming layer, which enhanced the fine crystal effect and further refined the grains. At the same time, the effect of removing defects was improved, and the defects such as pinhole and pitting corrosion on the surface of the electroforming layer were eliminated. The performance of the electroforming layer was improved. In the experiment, the experimental parameters of traditional electroforming were DC power current density 3 A/dm² and cathode speed 15 r/min. The parameters of the microbead adaptive auxiliary grinding pulse electroforming were the average current density of the pulse power supply 3 A/dm², duty cycle 50%, pulse frequency 800 Hz and cathode speed 15 r/min. In other tests, the cathode rotation speed was 15 r/min, the average current density was 3A/dm2, and the pulse frequency in the duty cycle experiment was 800 Hz, and the duty cycle was 20%, 40%, 60% and 80%, respectively. In the experiment, the duty cycle was 20%, and the pulse frequencies were 100, 500, 1 000 and 2 000 Hz, respectively. The difference between the properties of the electroforming nickel layer and the traditional electroforming process was studied, and the effect of pulse parameters on the micro-bead adaptive assisted grinding pulse electroforming nickel layer was studied. The effects of different pulse frequencies on the surface microstructure, microhardness and surface roughness of the electroforming layer were studied. The surface micromorphology (SEM), surface roughness (Ra), microhardness, metallographic structure and XRD of the electroforming layer with different duty cycle ratio were studied. Compared with the traditional electroforming process, the performance of the electroforming layer obtained by the micro-bead adaptive grinding pulse electroforming process was significantly improved. With the increase of pulse frequency, the performance of the electroforming layer was significantly improved, but when the pulse frequency was increased to 1 000 Hz, the performance improvement of the electroforming layer decreased. In contrast, the duty cycle ratio had a greater impact on the properties of the deposited layer:compared with the nickel layer deposited at 80% duty cycle, the surface roughness (Ra) of the nickel layer deposited at 20% duty cycle was reduced by approximately 52.5%, the microhardness value was increased by 14.12%, and the average grain size was reduced by 53.6%. XRD results showed that the diffraction intensity on the surface of (111) layer was the strongest, and the diffraction intensity on the surface of (200) layer was the weakest, and the difference between them was the smallest. For optimum grain orientation, when other conditions remain unchanged, the grain size of the electroforming layer coarsened gradually, and the microhardness, surface roughness and grain preference orientation decreased gradually with the gradual increase of duty cycle. The results show that the performance of the electroforming nickel layer can be improved by adopting the micro-bead adaptive grinding pulse electroforming process. Larger pulse frequency can improve the effect of grain refinement and defect removal, but further increase of pulse frequency has little effect on the properties of the deposited nickel layer. The effect of pulse power supply with lower duty cycle can improve grain refinement and defect removal.
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