赵翠翠,刘成炜,于晓琳,焦可如,黄树涛.Cu/diamond复合材料平面研磨实验研究[J].表面技术,2025,54(10):208-224.
ZHAO Cuicui,LIU Chengwei,YU Xiaolin,JIAO Keru,HUANG Shutao.Experimental Study of Surface Lapping of Cu/diamond Composites[J].Surface Technology,2025,54(10):208-224 |
| Cu/diamond复合材料平面研磨实验研究 |
| Experimental Study of Surface Lapping of Cu/diamond Composites |
| 投稿时间：2024-10-10 修订日期：2025-04-01 |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.10.017 |
| 中文关键词: Cu/diamond复合材料 平面研磨 材料去除率 表面粗糙度 表面形貌 研磨参数 |
| 英文关键词:Cu/diamond composites flat lapping material removal rate surface roughness surface morphology lapping parameters |
| 基金项目:中央引导地方科技发展资金(自由探索类基础研究)资助(2023JH6/100100045) |
| 作者 | 单位 |
| 赵翠翠 | 沈阳理工大学 机械工程学院，沈阳 110159 |
| 刘成炜 | 沈阳理工大学 机械工程学院，沈阳 110159 |
| 于晓琳 | 沈阳理工大学 机械工程学院，沈阳 110159 |
| 焦可如 | 沈阳理工大学 机械工程学院，沈阳 110159 |
| 黄树涛 | 沈阳理工大学 机械工程学院，沈阳 110159 |
|
| Author | Institution |
| ZHAO Cuicui | College of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| LIU Chengwei | College of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| YU Xiaolin | College of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| JIAO Keru | College of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China |
| HUANG Shutao | College of Mechanical Engineering, Shenyang Ligong University, Shenyang 110159, China |
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| 中文摘要: |
| 目的 为实现Cu/diamond复合材料表面高效平坦化的研磨加工提供理论和实验基础，满足该材料应用需求。方法 对Cu/diamond复合材料进行平面研磨加工实验，研究了研磨盘转速、研磨压力及磨粒粒度对研磨表面质量和材料去除率的影响。结果 实验结果表明:Cu/diamond复合材料研磨过程中金刚石增强颗粒的去除形式主要包括延性去除、局部破碎、整体脱落、表面和边缘微小脆性破碎几种形式;研磨表面金刚石增强颗粒与Cu基体两相之间呈现台阶现象，随着金刚石磨粒粒度的增加台阶现象越显著，增强颗粒研磨表面整体平整，增强颗粒间的基体区域较为平坦;Cu/diamond复合材料研磨过程材料去除率随研磨盘转速、研磨压力的增大先增大后减小，随磨粒粒度的增大而增大，研磨盘转速对表面粗糙度影响不大，研磨压力对表面质量的影响大于研磨盘转速，其中磨粒粒度对表面质量及材料去除率的影响最为显著;综合研磨加工效果，Cu/diamond复合材料在研磨120 min，研磨盘转速为180 r/min、研磨压力为1.2 MPa、金刚石磨粒粒度为W14的条件下加工，可以获得表面粗糙度为0.488 μm的平坦表面，材料去除率可达0.785 μm/min。结论 通过合理选择研磨速度、研磨压力和金刚石磨料粒度对Cu/diamond复合材料进行研磨加工，能够以较高的研磨效率获得较为平坦的表面。 |
| 英文摘要: |
| As a new type of electronic packaging material, Cu/diamond composites have excellent characteristics such as high thermal conductivity and low thermal expansion coefficient, and are becoming an important packaging material for high-performance electronic systems. However, electronic packaging materials have extremely strict requirements for surface flatness and dimensional accuracy. In order to achieve efficient and flat lapping process of Cu/diamond composite surface and meet the application requirements of the material, a theoretical and experimental basis is provided. In this paper, a plane lapping test of Cu/diamond composites is carried out with a cast iron lapping disc and diamond powder, and the influence of lapping disc rotating speed, lapping pressure and diamond abrasive grain size on the lapping surface quality and the material removal rate is studied. A precision electronic balance and a digital micrometer are used to measure and calculate the material removal rate. When evaluating the lapping surface quality, the two key indicators of surface roughness and surface morphology are comprehensively considered. The experimental results show that the removal forms of diamond-reinforced particles during the lapping process of Cu/diamond composites mainly include ductile removal, local crushing, overall shedding, and micro-brittle crushing on the surface and edge. There is a step phenomenon between the two phases of the diamond-reinforced particles and the Cu matrix on the lapping surface, which is because the lapping of diamond abrasive particles on the surface of the workpiece is uniform. The diamond-reinforced particles are removed by lapping under the action of high-frequency marking of diamond abrasive grains, and the thickness of the removal is shallow. Copper substrates are easier to remove than diamond-reinforced particles. Therefore, the lapping plane of diamond-reinforced particles is used as the supporting surface to form a cutting step lapping surface on the copper matrix. Moreover, the step becomes more obvious with the increase of diamond abrasive grain size. The lapping surface of diamond-reinforced particles generally shows good flatness, and the Cu matrix area between reinforced particles is relatively flat, so the machining quality is good. In the lapping process of Cu/diamond composites, with the increase of lapping disc speed and lapping pressure, the material removal rate shows a trend of increase first and then decrease, and the material removal rate increases with the increase of the abrasive particle size. In addition, the rotating speed of the lapping disc has little influence on the surface roughness, and the lapping pressure has more influence on the surface quality than the rotating speed of the lapping disc. The abrasive grain size has the most significant influence on the surface quality and the material removal rate. The smaller the abrasive grain size is, the better the surface quality is, but the lapping efficiency is low. Comprehensive lapping processing effect:when the lapping time is 120 min, the lapping disc speed is 180 r/min, the lapping pressure is 1.2 MPa, the diamond abrasive grain size is W14, a relatively flat surface is obtained, the surface roughness is 0.488 μm, and the material removal rate is 0.785 μm/min. It can be seen that the lapping efficiency can be significantly improved and a relatively flat lapping surface can be obtained by reasonably selecting the rotating speed of the lapping disc, lapping pressure and diamond abrasive particle size, which lays a solid foundation for the subsequent application of Cu/diamond composites. |
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