李颂华,田凯,赵梓辰,左闯,王洪亮,郭昊.氮化硅陶瓷套圈窄深槽加工试验研究[J].表面技术,2025,54(8):156-166.
LI Songhua,TIAN Kai,ZHAO Zichen,ZUO Chuang,WANG Hongliang,GUO Hao.Experimental Study on Narrow and Deep Groove Machining of Silicon Nitride Ceramic Ring[J].Surface Technology,2025,54(8):156-166 |
| 氮化硅陶瓷套圈窄深槽加工试验研究 |
| Experimental Study on Narrow and Deep Groove Machining of Silicon Nitride Ceramic Ring |
| 投稿时间：2024-08-07 修订日期：2024-12-17 |
| DOI：10.16490/j.cnki.issn.1001-3660.2025.08.014 |
| 中文关键词: 薄片砂轮 氮化硅陶瓷 窄深槽 边缘破碎 表面粗糙度 |
| 英文关键词:thin section grinding wheel silicon nitride ceramics narrow deep groove edge damage surface roughness |
| 基金项目:国家自然科学基金(联合基金)重点项目(U23A20631);辽宁省产业技术创新重点攻关任务“揭榜挂帅”项目(辽工信投资〔2023〕171号) |
| 作者 | 单位 |
| 李颂华 | 沈阳建筑大学 机械工程学院，沈阳 110168;高档石材数控加工装备与技术国家地方联合工程实验室，沈阳 110168 |
| 田凯 | 沈阳建筑大学 机械工程学院，沈阳 110168 |
| 赵梓辰 | 沈阳建筑大学 机械工程学院，沈阳 110168 |
| 左闯 | 沈阳建筑大学 机械工程学院，沈阳 110168 |
| 王洪亮 | 沈阳建筑大学 机械工程学院，沈阳 110168 |
| 郭昊 | 沈阳建筑大学 机械工程学院，沈阳 110168 |
|
| Author | Institution |
| LI Songhua | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China;National-Local Joint Engineering Laboratory of NC Machining Equipment and Technology of High-Grade Stone, Shenyang 110168, China |
| TIAN Kai | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China |
| ZHAO Zichen | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China |
| ZUO Chuang | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China |
| WANG Hongliang | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China |
| GUO Hao | School of Mechanical Engineering, Shenyang Jianzhu University, Shenyang 110168, China |
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| 中文摘要: |
| 目的 确定薄片砂轮磨削氮化硅陶瓷窄深槽时槽边缘破碎程度小和槽侧壁表面质量高的最优加工参数范围。方法 创新性地提出一种窄深槽加工质量的评价方法，以槽边缘平均崩口宽度Wd衡量边缘破碎程度，以表面粗糙度Ra评判窄深槽侧壁的表面质量。首先通过三因素四水平正交试验，确定砂轮线速度、砂轮进给速度和工件线速度对Wd值和表面粗糙度影响的主次顺序，随后通过单因素试验探究磨削参数对窄深槽磨削质量的影响机制与影响规律，选取氮化硅陶瓷窄深槽高侧壁表面质量、低边缘损伤的磨削工艺参数。结果 磨削参数对Wd值和侧壁表面粗糙度的影响程度皆为:砂轮线速度＞砂轮进给速度＞工件线速度。Wd值和表面粗糙度随砂轮线速度的增加先减后增;随着砂轮进给速度的增加，两者均逐渐增大;而工件线速度的提升导致Wd值持续增大，表面粗糙度则呈现先减小后增大的趋势。结论 研究发现，为实现氮化硅陶瓷窄深槽高侧壁表面质量、低边缘损伤的磨削加工，可适当降低砂轮进给速度和工件线速度，提高砂轮线速度。推荐选取砂轮线速度为50 m/s、砂轮进给速度为3 μm/min、工件线速度为0.15~0.45 m/s，可将Wd值控制在15 μm以内，表面粗糙度控制在0.050 μm以内，从而满足氮化硅陶瓷窄深槽高侧壁表面质量、低边缘损伤磨削加工要求。 |
| 英文摘要: |
| The grinding undercut of silicon nitride (Si3N4) ceramic cylindrical roller bearing rings is a narrow and deep groove, and its grinding is a key process for precision grinding of bearing rings. The damage of groove edges and the surface quality of groove side walls have an important influence on the dimensional accuracy and service performance of cylindrical roller bearings. In order to determine the optimal processing parameter range of low edge breakage and high side wall surface quality when grinding silicon nitride ceramic narrow and deep grooves with a thin slice grinding wheel. An innovative evaluation method for the grinding quality of narrow and deep grooves is proposed. The surface roughness Ra of the side wall of the narrow and deep groove and the average edge width Wd of the narrow and deep groove edge are taken as the main evaluation indexes of the machining quality of the narrow and deep groove. Firstly, through the orthogonal test of three factors and four levels, in the range of grinding parameters at grinding wheel linear speed of 34~58 m/s, grinding wheel feed speed of 4~ 16 μm/min and workpiece linear speed of 0.3~0.9 m/s, the primary and secondary order of the influence of the three factors of grinding wheel linear speed, grinding wheel feed speed and workpiece linear speed on the Wd value and Ra value of the silicon nitride ceramic narrow deep groove is determined. Then, the grinding parameter range of the single factor test is determined:the linear speed of the grinding wheel is 35-60 m/s, the feed speed of the grinding wheel is 3-18 um/min, and the linear speed of the workpiece is 0.15-0.9 m/s. Through 18 groups of single factor experiments, the influence mechanism and influence law of grinding parameters on the edge crushing of the narrow deep groove and the surface quality of the groove side wall are explored, and the grinding process parameters of low edge damage and high surface quality of the silicon nitride ceramic narrow deep groove are optimized. The experimental results show that the influence of grinding parameters on the average chipping width Wd value and the surface roughness of the side wall of the narrow and deep groove is in the order of grinding wheel linear speed, grinding wheel feed speed and workpiece linear speed. Wd value and Ra decrease first and then increase with the increase of the grinding wheel speed. When the grinding wheel speed is 50 m/s, both Wd and Ra reach the minimum value. As the feed speed of the grinding wheel increases, both of them increase gradually. The increase of workpiece linear speed leads to the increase of Wd value, and Ra shows a trend of decreasing first and then increasing. It is found that in order to realize the high quality and low damage grinding of the silicon nitride ceramic narrow deep groove, the grinding wheel feed speed and the workpiece linear speed can be appropriately reduced, and the linear speed of the grinding wheel can be improved to ensure the machining quality of the narrow deep groove. It is recommended that the grinding wheel linear speed is 50 m/s, the grinding wheel feed speed is 3 μm/min, and the workpiece linear speed is 0.15-0.45 m/s. The Wd value can be controlled within 15 μm, and the surface roughness can be controlled within 0.050 μm, which meets the requirements of high sidewall surface quality and low edge damage grinding of silicon nitride ceramic narrow deep grooves. |
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