卢文涛,刘金帛,张园,鲍岩,董志刚,康仁科.钨合金超声辅助划擦试验及仿真研究[J].表面技术,2024,53(6):133-143.
LU Wentao,LIU Jinbo,ZHANG Yuan,BAO Yan,DONG Zhigang,KANG Renke.Simulation and Experimental Study on Ultrasonic Assisted Scratching of Tungsten Alloy[J].Surface Technology,2024,53(6):133-143 |
| 钨合金超声辅助划擦试验及仿真研究 |
| Simulation and Experimental Study on Ultrasonic Assisted Scratching of Tungsten Alloy |
| 投稿时间：2023-03-17 修订日期：2023-07-29 |
| DOI：10.16490/j.cnki.issn.1001-3660.2024.06.012 |
| 中文关键词: 钨合金 单颗金刚石 超声辅助划擦 材料去除机理 有限元仿真 |
| 英文关键词:tungsten alloy single diamond ultrasonic assisted scratching material removal mechanism finite element simulation |
| 基金项目:国家重点研发计划项目(2022YFB3402300);国家自然科学基金面上项目(52275411);中央高校基本科研业务费(DUT22ZD201) |
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| Author | Institution |
| LU Wentao | Dalian University of Technology, Liaoning Dalian 116024, China |
| LIU Jinbo | Dalian University of Technology, Liaoning Dalian 116024, China |
| ZHANG Yuan | Dalian University of Technology, Liaoning Dalian 116024, China |
| BAO Yan | Dalian University of Technology, Liaoning Dalian 116024, China |
| DONG Zhigang | Dalian University of Technology, Liaoning Dalian 116024, China |
| KANG Renke | Dalian University of Technology, Liaoning Dalian 116024, China |
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| 中文摘要: |
| 目的 揭示钨合金在超声辅助磨削加工下的材料去除行为。方法 通过超声辅助划擦试验与有限元仿真相结合的方式，分析超声振动作用对材料表面形貌、截面轮廓、划擦力、温度、塑性应变及应变率的影响，探究超声振动作用下的材料去除和表面创成机理。结果 钨合金在划擦过程中发生严重的塑性变形，在划痕两侧出现由耕犁作用而形成的隆起现象。超声辅助划擦形成的划痕表面鳞刺更少且未出现犁沟现象，且划痕深度相较于普通划擦增大14.1%，划痕宽度增大39%。随着划擦深度的增加，试验划擦力与仿真划擦力均线性增大，且仿真值与试验值误差为18.1%，验证了有限元仿真模型的有效性。超声振动作用下的划擦力呈周期性变化特征，使平均划擦力降低了43.2%。此外，仿真结果表明，超声辅助划擦相较于普通划擦，温度最高降低50%，表面塑性应变最高降低20%，超声冲击过程中材料的塑性应变率相较于普通划擦提高1个数量级，分离过程中塑性应变率最大降低2个数量级。结论 超声振动作用可以有效降低划擦过程中的划擦力和划擦区域温度，增大冲击过程中材料的瞬时应变率，改善压头的切屑黏附现象，从而抑制划擦表面鳞刺的生成和犁沟的形成，改善表面质量。此外，超声振动作用还可以有效提高材料去除率。 |
| 英文摘要: |
| Ultrasonic assisted grinding technology has been utilized to overcome the challenges of severe tool wear and chip adhesion in conventional tungsten alloy grinding. However, the mechanism of material removal under ultrasonic vibration remains unclear. In this research, ultrasonic assisted scratching (UAS) experiment was conducted to investigate the effect of ultrasonic vibration on material surface morphology, cross-sectional profile, and scratching force. A coupled Eulerian-Lagrange (CEL) finite-element (FE) simulation model was established to analyze the changes in scratching force, material temperature, plastic strain, and strain rate during the vibration process. Both simulation and experimental methods revealed the mechanism of material removal and surface creation under ultrasonic vibration action. Firstly, the surface morphology of the scratches was observed by Scanning Electron Microscope (SEM). The result showed that tungsten alloy suffered severe plastic deformation during the scratching process, forming an uplift phenomenon on both sides of the scratches by plowing action. The indenter tended to adhere to the chips during the conventional scratching (CS) process, which resulted in the formation of burrs and plowing groove in the scratching process. In contrast, the UAS surface showed fewer burrs and clear bottom edge, which proved that ultrasonic vibration action could reduce the chip adhesion phenomenon on the indenter. Therefore, the ultrasonic vibration action could effectively suppress the generation of burrs on the scratching surface and the formation of plowing groove at the bottom of the scratches. Posteriorly, the three-dimensional topography of the scratches and their cross-sectional profiles were analyzed by Laser Scan Confocal Microscopy (LSCM), and the result showed that the width of the scratches formed by UAS increased by 39% and the depth increased by 14.1% compared with CS, indicating that larger volume of material was removed by UAS. Subsequently, the changing trend of scratching force with scratching depth of the simulation model was consistent with the experimental results, and the error between the simulation value and the experimental value was 18.1%, which verified the availability of the FE simulation model. Compared with the CS, the scratching force of ultrasonic experiment was reduced by 43.2%. The simulated scratching force showed that the short contact and long separation between the indenter and the workpiece in the UAS process made the scratching force change periodically, which could reduce the average force of the scratching process. Finally, by extracting and analyzing the simulated physical field data of UAS at different time, it was found that the temperature of UAS was reduced by 50% and the surface plastic strain was reduced by 20% compared with the CS process, and the plastic strain rate of the material during ultrasonic impact was increased by one order of magnitude compared with the CS, while the separation process was reduced by two orders of magnitude at most. The aforementioned results indicate that ultrasonic vibration can effectively reduce the scratching force and temperature of the scratching area while also increasing the transient strain rate of the material during the impact process. This prevents chip adhesion to the indenter and inhibits the generation of burrs and plowing groove on the scratching surface, improving surface quality. Additionally, the ultrasonic vibration effect can effectively enhance the material removal rate. |
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