庄宁,卢帅,张博威,赵梦雅,黄康,张展,何业东,吴俊升.阴极等离子电解沉积技术简介及其研究进展[J].表面技术,2023,52(10):32-47.
ZHUANG Ning,LU Shuai,ZHANG Bo-wei,ZHAO Meng-ya,HUANG Kang,ZHANG Zhan,HE Ye-dong,WU Jun-sheng.Introduction and Research Progress of Cathode Plasma Electrodeposition Technology[J].Surface Technology,2023,52(10):32-47
阴极等离子电解沉积技术简介及其研究进展
Introduction and Research Progress of Cathode Plasma Electrodeposition Technology
投稿时间:2022-09-05  修订日期:2023-02-22
DOI:10.16490/j.cnki.issn.1001-3660.2023.10.003
中文关键词:  阴极等离子电解沉积  原理  参数  涂层  应用  前景
英文关键词:cathodic plasma electrodeposition  principle  parameter  coating  application  prospect
基金项目:西南技术工程研究所合作基金项目(HDHDW5902020107);国家自然科学基金(51901018);中国科协青年托举人才项目(2019QNRC001);中央高校基本科研业务费(06500119);科技部科技基础资源调查专项资助项目(2019FY101400)
作者单位
庄宁 北京科技大学,北京 100083 
卢帅 北京科技大学,北京 100083 
张博威 北京科技大学,北京 100083 
赵梦雅 北京科技大学,北京 100083 
黄康 北京科技大学,北京 100083 
张展 北京科技大学,北京 100083 
何业东 北京科技大学,北京 100083 
吴俊升 北京科技大学,北京 100083 
AuthorInstitution
ZHUANG Ning University of Science and Technology Beijing, Beijing 100083, China 
LU Shuai University of Science and Technology Beijing, Beijing 100083, China 
ZHANG Bo-wei University of Science and Technology Beijing, Beijing 100083, China 
ZHAO Meng-ya University of Science and Technology Beijing, Beijing 100083, China 
HUANG Kang University of Science and Technology Beijing, Beijing 100083, China 
ZHANG Zhan University of Science and Technology Beijing, Beijing 100083, China 
HE Ye-dong University of Science and Technology Beijing, Beijing 100083, China 
WU Jun-sheng University of Science and Technology Beijing, Beijing 100083, China 
摘要点击次数:
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中文摘要:
      阴极等离子电解沉积是一种将传统电解和等离子体相结合的表面处理与材料制备技术,与传统的表面处理技术相比,该技术在能量消耗、制备速率、沉积层表面致密度、与基体结合力等方面均有大幅度改善,因此备受关注。概述了阴极等离子电解沉积的基本机理,包括电压-电流的演变过程、气体鞘层的形成过程、等离子体的演变规律和金属离子的沉积现象等,在此基础上讲解了阴极等离子电解沉积的技术优势。针对阴极等离子电解沉积过程中复杂的影响因素,分析并探讨了电压、占空比、时间等电参数以及酸含量、添加剂、电解液浓度等溶液参数对阴极等离子电解沉积的影响规律。在此基础上,重点综述了近年来阴极等离子电解沉积在多个领域的研究进展,包括先进陶瓷涂层、金属涂层以及复合涂层的制备,纳米电催化剂、纳米微球、中空微球和石墨烯等功能材料的合成以及渗碳、渗氮等领域的应用等。最后总结并展望了阴极等离子电解沉积在涂层领域的发展方向以及催化剂、石墨烯等其他新型领域的研究前景。
英文摘要:
      Cathodic plasma electrodeposition is a surface treatment and material preparation technology that combines traditional electrolysis technology and plasma. Compared with the traditional surface treatment and material preparation technology, the advanced technology of cathodic plasma electrolytic deposition can not only reduce the energy consumption in the deposition process, and improve the speed of surface treatment and material preparation, but also promote the increase of the density of the deposited layer and increase the bonding force between the deposited layer and the substrate. As a result, this advanced surface treatment and material preparation technology have attracted extensive attention from researchers in China and in other countries. In this work, the basic mechanism and evolution process of cathodic plasma electrolytic deposition are comprehensively explained. It includes the evolution of the voltage-current curve in the deposition process, the formation process of the gas sheath composed of hydrogen and water vapor near the cathode, the evolution law of plasma formed in the deposition process in the electrolyte, and the deposition phenomenon of metal ions gathered near the cathode gas sheath under the energized condition. Based on the analysis of the basic mechanism of the deposition process, the unique advantages of the cathodic plasma electrolytic deposition compared with other surface treatment and material preparation technologies are described. In view of the complex affecting factors in the process of the cathodic plasma electrodeposition, the effect of electrical parameters and solution parameters on the process and results of the cathodic plasma electrodeposition is analyzed and discussed in detail, and the effect rule of these electrical parameters and part of the solution parameters on the process of cathodic plasma electrodeposition are explained. The electrical parameters mainly include the operating voltage and deposition time in the straight and pulse modes, and the unique duty cycle and pulse frequency in the pulse mode. The solution parameters include acid content, electrolyte type, electrolyte concentration, solvent type, and additives such as polyethylene glycol, glycerol, carbon nanotubes, metal particles, etc. Through the analysis and discussion of the above factors, it provides the possibility for researchers from all over the world to freely control the morphology, structure, organization, and properties of the sedimentary layer by changing the experimental conditions, and obtaining the expected results. On the basis of analyzing and summarizing the basic mechanism and affecting factors of the above deposition process, the research progress of cathode plasma electrolytic deposition technology in many fields is analyzed. These research areas include advanced ceramic coatings, metal coatings and composite coatings in the field of coating preparation, catalyst field of high performance and self-support catalyst synthesis, microsphere synthesis field of nano microsphere and hollow microsphere, and graphene functional material synthesis and nitriding and carburizing and other material surface treatment field applications. Finally, combined with the current research hotspots, the potential application and development direction of cathodic plasma electrolytic deposition technology in the field of coatings, as well as the research prospects in new fields such as catalysts and graphene are analyzed and summarized.
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