段世祥,吕冰海,邓乾发.磨粒类型对K9玻璃剪切增稠抛光的影响[J].表面技术,2022,51(11):337-346, 384.
DUAN Shi-xiang,LYU Bing-hai,DENG Qian-fa.Effect of Abrasive Type on Shear Thickening Polishing of K9 Glass[J].Surface Technology,2022,51(11):337-346, 384
磨粒类型对K9玻璃剪切增稠抛光的影响
Effect of Abrasive Type on Shear Thickening Polishing of K9 Glass
  
DOI:10.16490/j.cnki.issn.1001-3660.2022.11.032
中文关键词:  剪切增稠抛光  K9玻璃  SiO2  CeO2  表面粗糙度
英文关键词:shear thickening polishing  K9 glass  SiO2  CeO2  surface roughness
基金项目:国家自然科学基金(52175441)
作者单位
段世祥 浙江工业大学 机械工程学院,杭州 310023 
吕冰海 浙江工业大学 机械工程学院,杭州 310023 
邓乾发 浙江工业大学 机械工程学院,杭州 310023 
AuthorInstitution
DUAN Shi-xiang College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China 
LYU Bing-hai College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China 
DENG Qian-fa College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310023, China 
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中文摘要:
      目的 采用剪切增稠抛光方法对K9玻璃进行抛光,以工件表面粗糙度Sa为评价指标,研究不同磨粒抛光液对K9玻璃的抛光效果。方法 采用金刚石、CeO2、Al2O3和SiO2等4种单一磨粒,以及金刚石+SiO2混合磨粒,制备了不同的剪切增稠抛光液,并测试其流变特性。以ϕ20 mm K9玻璃圆片为工件,首先在相同磨粒浓度下,进行4种单一磨粒抛光液的抛光实验,观测在抛光时间不同时工件表面粗糙度Sa的变化情况,比较4种抛光液的抛光效果。然后,对比CeO2抛光液与金刚石+SiO2混合磨粒抛光液的抛光效果,并分析讨论混合磨粒抛光液的材料去除过程。结果 使用CeO2抛光液抛光35 min后,将工件的表面粗糙度Sa从(233.1±15.2)nm降至(1.6±0.2)nm;金刚石抛光液次之,在抛光55 min后工件的表面粗糙度Sa达到(1.86± 0.2)nm;Al2O3抛光液的效果相对最差。采用SiO2(质量分数10%)+金刚石(质量分数5%)抛光液,在抛光5 min后工件的表面粗糙度Sa比CeO2抛光液的低53.3%;在抛光35 min后,工件的表面粗糙度Sa从(230.7±10.5)nm降至(1.43±0.9)nm。在金刚石(质量分数5%)抛光液中添加不同浓度SiO2磨粒的抛光实验中发现,在抛光初始阶段,抛光效率随着SiO2磨粒浓度的增加而增大。结论 CeO2抛光液和SiO2(质量分数10%)+金刚石(质量分数5%)抛光液的抛光效果相对最优,后者在低表面质量时的抛光效率更高。
英文摘要:
      K9 glass is one of the most common materials of optical components. The work aims to polish K9 glass workpiece with shear thickening polishing method, use the surface roughness Sa of the workpiece as the evaluation index to study the polishing effect of different abrasive slurry on K9 glass. In this paper, four kinds of abrasives of diamond, CeO2, Al2O3 and SiO2, and mixed abrasive of diamond+SiO2 were used to prepare different shear thickening polishing slurry, and their rheological properties were measured. Firstly, under the same concentration of abrasives, four experiments with different abrasives (diamond, CeO2, Al2O3 and SiO2) were carried out. The changes in the surface roughness Sa of the workpieces at different polishing times were observed, and the polishing effects of the four slurries were compared. Then, the polishing results of CeO2 slurry and diamond+SiO2 mixed abrasive slurry were compared, and the material removal process of mixed abrasive slurry, CeO2 slurry, Al2O3 slurry, SiO2 slurry and diamond slurry were discussed.Experimental results indicated that the peak viscosity of diamond, CeO2 and Al2O3 slurry decreased in order, the viscosity of SiO2 slurry increased with the increase of shear rate, showing continuous shear thickening and the peak viscosity of the mixed abrasive particles (SiO2+diamond) slurry were higher than other slurries, the peak viscosity of 10wt.% SiO2+5wt.% diamond slurry was higher than that of 5wt.% SiO2+10wt.% diamond slurry, but the peak shear rate was lower than the latter, compared with other abrasives, SiO2 abrasive can increase the peak shear rate of shear-thickening slurry; After 35 mins' polishing, the surface roughness Sa of the workpiece reduced from (233.1±15.2)nm to (1.6±0.2)nm by CeO2 slurry; After 55 mins' polishing diamond slurry can reach (1.86±0.2)nm; The effect of Al2O3 slurry was the worst, the surface roughness Sa of the workpiece reduced to (58.6±1.5)nm with 55 mins' polishing. After 35 mins' polishing 5wt.% SiO2+10wt.% diamond slurry can reach (2.4±1.2)nm, but in the first 5 mins, 5wt.% SiO2+10wt.% diamond slurry can reach a lower surface roughness Sa compare with CeO2 slurry. After 5 mins' polishing with 10wt.% SiO2+5wt.% diamond slurry, the surface roughness Sa was 53.3% lower than that obtained by CeO2 slurry, and decreased from (230.7±10.5)nm to (1.43±0.9)nm after 35 min polishing. In the initial stage of polishing, the polishing efficiency increased with the increase of SiO2 concentration in the 5wt.% diamond slurry. CeO2 slurry and 10wt.% SiO2+5wt.% diamond slurry had the best polishing effect. The latter had higher polishing efficiency when the surface quality was low. SiO2 abrasive were filled between the molecular chains formed by the solid dispersed particles in the polishing slurry, complementing the large size abrasive. SiO2 abrasive will remove the smaller slightly rough peaks on the workpiece surface, while the diamond abrasive can remove the larger slightly rough peaks. The large and small abrasives act synergistically to efficiently remove the slightly rough peaks on the surface of the workpiece to obtain an ultra-smooth surface.
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