曹之鸿,何洪途,李洪涛,李炳宏,银颖,余家欣.法向载荷和速度对β-HMX晶体纳米划痕性能的影响[J].表面技术,2022,51(11):253-261.
CAO Zhi-hong,HE Hong-tu,LI Hong-tao,LI Bing-hong,YIN Ying,YU Jia-xin.Effect of Normal Load and Velocity on Nanoscratch Behavior of β-HMX Crystals[J].Surface Technology,2022,51(11):253-261 |
| 法向载荷和速度对β-HMX晶体纳米划痕性能的影响 |
| Effect of Normal Load and Velocity on Nanoscratch Behavior of β-HMX Crystals |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.11.023 |
| 中文关键词: β-HMX晶体 纳米划痕 法向载荷 滑动速度 划痕深度 弹性回复 摩擦因数 |
| 英文关键词:β-HMX nanoscratch normal load scratch velocity scratch depth elastic recovery coefficient of friction |
| 基金项目:中国工程物理研究院院长基金(YZJJLX2020005) |
| 作者 | 单位 |
| 曹之鸿 | 西南科技大学 制造过程测试技术教育部重点实验室，四川 绵阳 621000 |
| 何洪途 | 西南科技大学 制造过程测试技术教育部重点实验室，四川 绵阳 621000 |
| 李洪涛 | 中国工程物理研究院 化工材料研究所，四川 绵阳 621999 |
| 李炳宏 | 西南科技大学 制造过程测试技术教育部重点实验室，四川 绵阳 621000 |
| 银颖 | 中国工程物理研究院 化工材料研究所，四川 绵阳 621999 |
| 余家欣 | 西南科技大学 制造过程测试技术教育部重点实验室，四川 绵阳 621000 |
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| Author | Institution |
| CAO Zhi-hong | Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Sichuan Mianyang 621000, China |
| HE Hong-tu | Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Sichuan Mianyang 621000, China |
| LI Hong-tao | Institute of Chemical Materials, China Academy of Engineering Physics, Sichuan Mianyang 621999, China |
| LI Bing-hong | Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Sichuan Mianyang 621000, China |
| YIN Ying | Institute of Chemical Materials, China Academy of Engineering Physics, Sichuan Mianyang 621999, China |
| YU Jia-xin | Key Laboratory of Testing Technology for Manufacturing Process, Southwest University of Science and Technology, Sichuan Mianyang 621000, China |
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| 中文摘要: |
| 目的 揭示β-HMX晶体在微观尺度下的摩擦和磨损特性。方法 对β-HMX晶体进行镶样抛光，并使用圆锥形金刚石探针在纳米划痕仪上进行定载划痕试验，获得β-HMX晶体在不同法向载荷和滑动速度下的划入深度、残余深度和摩擦因数，再通过光学显微镜表征晶体的表面损伤形貌。结果 当法向载荷从0.5 mN增加到3.5 mN，β-HMX晶体表面摩擦因数约增大2倍，划入深度和残余深度也明显增加，晶体表面发生从弹性变形到塑性变形再到脆性去除3个阶段。当滑动速度从5 μm/s逐渐增加到100 μm/s时，β-HMX晶体表面的摩擦因数减小约17%，划入深度和残余深度缓慢降低，晶体表面损伤形貌无明显区别。结论 β-HMX晶体的摩擦因数随法向载荷的增加而增大，随滑动速度的增加而减小，且黏着摩擦因数大于犁沟摩擦因数。随着法向载荷的增加，划痕的划入深度和残余深度增加，弹性恢复率减小。随着滑动速度的增加，划痕的划入深度和残余深度减小，弹性恢复率增加。另外，随着法向载荷的增加，晶体的损伤形式经历从弹塑性变形到脆性破坏的转变，而随着滑动速度的增加，损伤情况变化不明显，表面损伤机制表现为机械性损伤与去除。 |
| 英文摘要: |
| As a mainly polymer bonded explosive (PBX) system, the tribology behavior of β-HMX crystal is mostly conducted by macro-scale experiments, where the friction characteristics come from the joint action of binder and energetic crystal. Most importantly, it is impossible to distinguish the friction contribution from binder and energetic crystal from macro-scale experiments. Experimental research on micro-friction behavior and mechanism can provide a deeper understanding of the friction of β-HMX crystal. In this study, the scratch depth and residual depth as well as coefficient of friction (COF) of β-HMX crystal under different normal loads and scratch velocities were obtained from the nanoscratch experiments, and the influences of normal load and scratch velocity on tribological behaviors were discussed. |
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