赵栋才,邱家稳,肖更竭,张子扬.辅助阳极在电弧离子镀和磁控溅射技术中的应用和研究进展[J].表面技术,2022,51(11):174-185.
ZHAO Dong-cai,QIU Jia-wen,XIAO Geng-jie,ZHANG Zi-yang.Application and Research Progress of Auxiliary Anode in Arc Ion and Magnetron Sputtering Deposition[J].Surface Technology,2022,51(11):174-185 |
| 辅助阳极在电弧离子镀和磁控溅射技术中的应用和研究进展 |
| Application and Research Progress of Auxiliary Anode in Arc Ion and Magnetron Sputtering Deposition |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.11.015 |
| 中文关键词: 辅助阳极 电弧离子镀 磁控溅射 离化率 大颗粒过滤 |
| 英文关键词:auxiliary anode arc ion plating magnetron sputtering ionization rate large particle filtration |
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| Author | Institution |
| ZHAO Dong-cai | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education, Anhui University of Technology, Anhui Maanshan 243002, China |
| QIU Jia-wen | China Academy of Space Technology, Beijing 100094, China |
| XIAO Geng-jie | Lanzhou Institute of Physics, Lanzhou 730000, China |
| ZHANG Zi-yang | Key Laboratory of Green Fabrication and Surface Technology of Advanced Metal Materials, Ministry of Education, Anhui University of Technology, Anhui Maanshan 243002, China |
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| 中文摘要: |
| 按照位置分类，概述了3类辅助阳极。第1类布置在阴极附近，能起到吸引电子，增大离化率，并降低沉积温度的效果，同时若有带负电的离子，也会被吸引至阳极;第2类布置在基片的背面，在吸引电子达到阳极的过程中，会增大基片附近工艺气体和沉积物的离化率，正离子在负偏压的引导下会和基底发生碰撞，达到基底活化或者提高膜层质量的目的;第3类为特殊工件类，如管内壁镀膜时通过辅助阳极的布置，提高管腔内等离子体的均匀性，从而增加膜层厚度和质量的一致性。辅助阳极的增加只需在真空室特定位置布置特定形状的阳极即可，即使需要额外引线，只需一个接线法兰口就能完成，非常方便。辅助阳极加载的正电压一般在0至几百伏之间，如果是0，则直接和真空腔室连接即可，必要时串联电阻。辅助阳极技术具有改变离子能量和方向的特点，能起到对大颗粒的抑制作用，能改变到达膜层表面离子的能量，对膜层质量的提高具有重要意义，值得推广。 |
| 英文摘要: |
| Through arc ion plating and sputtering deposition equipment, it can load a specific electric field to provide conditions for gas ionization, and load a magnetic field not parallel to the direction of the electric field to make electrons move spirally along the direction of the magnetic field. Also, it can further increase the probability of gas ionization, which is an important method to obtain the desired film quality. The plasma is distributed between the anode and cathode. The magnetic field increases the ionization rate, but it will not change the overall transport direction of electrons and ions in the plasma. At this time, if a pair of anodes and cathodes are added in addition to the original anode and cathode, the transport of electrons and ions between the new anode and cathode will be increased, resulting in great changes in the plasma layout, It will have a significant impact on the movement direction of large particles in the plasma, and guide the plasma to complete the surface treatment of special workpiece for original inaccessible place. The method of adding anode and cathode is often called auxiliary anode technology because the cathode is often equipotential with the vacuum chamber. The location of the auxiliary anode can be divided into three types:1) it can attract electrons, increase the ionization rate, and reduce the deposition temperature when it is placed near the cathode. At the same time, if there are negatively charged ions, it will also be attracted to the anode. In arc ion plating technology, large particles have large collision cross section, which is easy to collide with electrons and be negatively charged, so large particles will be attracted by anode to achieve the purpose of large particle filtration. 2) The anode is arranged on the back of the substrate. In the process of attracting electrons to the anode, the ionization rate of process gas and sediment near the substrate will increase, and the positive ions will collide with the substrate under the guidance of negative bias, so as to activate the substrate or improve the quality of the film. 3) For special workpieces, such as coating on the inner wall of the tube, the arrangement of auxiliary anodes can improve the uniformity of plasma in the tube cavity, so as to increase the consistency of film thickness and quality. The addition of electric field can be realized by auxiliary anode, and the addition of auxiliary anode only needs to arrange anode with specific shape at specific position of vacuum chamber. Even though additional leads are needed, it only needs a flange port, which is very convenient. The positive voltage of the auxiliary anode is usually between zero and several hundred volts. If it is zero volts, it can be directly connected with the vacuum chamber. That is to say, a certain part of the vacuum chamber can be designed specifically to meet the requirements. Auxiliary anode technology has the characteristics of changing ion energy and direction, which can inhibit large particles and change the ion energy reaching the surface of the film. It is of great significance to improve the quality of the film and worth promoting. |
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