谢林圯,师文庆,吴腾,龚美美,黄江,谢玉萍,何宽芳.曲面基底工件激光熔覆温度场与应力场数值模拟[J].表面技术,2022,51(3):296-303, 325.
XIE Lin-yi,SHI Wen-qing,WU Teng,GONG Mei-mei,HUANG Jiang,XIE Yu-ping,HE Kuan-fang.Numerical Simulation of Temperature Field and Stress Field of Laser Cladding on Curved Substrate Workpiece[J].Surface Technology,2022,51(3):296-303, 325 |
| 曲面基底工件激光熔覆温度场与应力场数值模拟 |
| Numerical Simulation of Temperature Field and Stress Field of Laser Cladding on Curved Substrate Workpiece |
| 投稿时间：2021-04-15 修订日期：2021-08-24 |
| DOI：10.16490/j.cnki.issn.1001-3660.2022.03.032 |
| 中文关键词: 激光技术 Ansys 数值模拟 曲面基底 温度场 残余应力 |
| 英文关键词:laser technology Ansys numerical simulation curved base temperature field residual stress |
| 基金项目:国家自然科学基金(62073089);广东省普通高校重点领域专项(2020ZDZX2061) |
| 作者 | 单位 |
| 谢林圯 | 广东海洋大学，广东 湛江 524088 |
| 师文庆 | 广东海洋大学，广东 湛江 524088 |
| 吴腾 | 广东海洋大学，广东 湛江 524088 |
| 龚美美 | 广东海洋大学，广东 湛江 524088 |
| 黄江 | 广东海洋大学，广东 湛江 524088 |
| 谢玉萍 | 广东海洋大学，广东 湛江 524088 |
| 何宽芳 | 佛山科学技术学院，广东 佛山 528225 |
|
| Author | Institution |
| XIE Lin-yi | Guangdong Ocean University, Zhanjiang 524088, China |
| SHI Wen-qing | Guangdong Ocean University, Zhanjiang 524088, China |
| WU Teng | Guangdong Ocean University, Zhanjiang 524088, China |
| GONG Mei-mei | Guangdong Ocean University, Zhanjiang 524088, China |
| HUANG Jiang | Guangdong Ocean University, Zhanjiang 524088, China |
| XIE Yu-ping | Guangdong Ocean University, Zhanjiang 524088, China |
| HE Kuan-fang | Foshan University, Foshan 528225, China |
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| 中文摘要: |
| 目的 研究曲面基底工件激光熔覆的温度场和应力场分布情况。方法 采用数值模拟的方法模拟激光熔覆及冷却过程中的温度场和应力场。通过Ansys软件，采用高斯热源模型模拟圆环柱曲面基底外表面上的激光熔覆过程。在加工过程中，激光头与基底的相对运动为螺旋运动。分析不同功率和扫描速度对温度场和残余应力的影响，以及应力场随时间的变化和残余应力的分布情况。结果 扫描速度对温度场的影响较大，功率和扫描速度对残余应力无明显直接影响，不同功率和扫描速度的残余应力最大值都出现工件外壁中部。在XZ轴面上的径向应力呈现出漏斗形，四周高，中间低，大部分都在–20~20 MPa，起伏较小;周向应力在XZ轴面对角线方向上呈近似抛物线，两端高，中间低，最高值为100 MPa，最低值为–50 MPa，起伏较大;厚度方向的应力分布呈近似半圆锥三维形状，在Z轴方向上为近似直线，在X轴方向上为近似半抛物线，呈现出一端高、一端低、中间部分逐渐下降的趋势，最高值为110 MPa，最低值为–30 MPa，起伏较大。结论 成功研究了曲面基底工件激光熔覆的温度场和应力场分布情况，对曲面基底激光熔覆的工艺参数优化和提高产品质量有一定指导作用。 |
| 英文摘要: |
| This paper aims to study the distribution of temperature field and stress field in laser cladding of workpiece with the curved substrate. In the laser cladding and cooling process, the temperature field and stress field were simulated by numerical simulation. In particular, the laser cladding process was simulated by using the Gaussian heat source model with Ansys software on the outer surface of the substrate of the annulated circular cylinder surface, in which the relative motion was a spiral motion in the processing between the laser head and the substrate. The influence of different power and scanning speed on temperature field and residual stress, as well as the variation of stress field with time and the distribution of residual stress, were analyzed. The results showed that the scanning speed had a great effect on the temperature field. The power and scanning speed had no obvious direct effect on the residual stress. The maximum residual stress appeared in the middle of the outer wall of the workpiece at different power and scanning speed. On the XZ plane, the radial stress showed a funnel shape with high stress around and low stress in the middle. Most of the stress range from +20 MPa to –20 MPa, and the fluctuation was small. On the XZ plane, the circumferential stress was an approximate parabola in the direction of the diagonal, with high values at both ends and low values in the middle. The high value was 100 MPa and the low value was –50 MPa, which fluctuated greatly. In the direction of thickness, the stress distribution was an approximate semi-conical three-dimensional shape. It was an approximately straight line in the direction of the Z-axis, and was an approximate semi-parabola in the direction of the X-axis. It showed that one end is high, one end was low, and the middle part gradually decreased. The high value was 110 MPa, and the low value was –30 MPa, with great fluctuation. It is concluded that the distribution of temperature field and stress field of laser cladding on the curved substrate has been studied successfully, which is helpful to optimize the process parameters and improve the quality of products. |
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