蒋峥瑾,吴道新,肖忠良,李昕,梁奥博,周光华,黄勇.表面活性剂对化学镀镍影响机理的研究[J].表面技术,2021,50(9):293-302.
JIANG Zheng-jin,WU Dao-xin,XIAO Zhong-liang,LI Xin,LIANG Ao-bo,ZHOU Guang-hua,HUANG Yong.Research on the Effect Mechanism of Surfactant on Electroless Nickel Plating[J].Surface Technology,2021,50(9):293-302 |
| 表面活性剂对化学镀镍影响机理的研究 |
| Research on the Effect Mechanism of Surfactant on Electroless Nickel Plating |
| 投稿时间：2020-09-23 修订日期：2021-03-24 |
| DOI：10.16490/j.cnki.issn.1001-3660.2021.09.031 |
| 中文关键词: 化学镀镍 表面活性剂 吸附能 均匀性 |
| 英文关键词:electroless nickel plating surfactant adsorption energy uniformity |
| 基金项目:湖南省战略性新型重大项目(2019GK4041);长沙市科技计划项目(kq1907095);长沙理工大学专业学位研究生实践创新与创业能力提升项目(SJCX202081) |
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| Author | Institution |
| JIANG Zheng-jin | School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China |
| WU Dao-xin | School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China |
| XIAO Zhong-liang | School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China |
| LI Xin | School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China |
| LIANG Ao-bo | School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China |
| ZHOU Guang-hua | Aoshikang Technology Co.Ltd, Yiyang 413000, China |
| HUANG Yong | Aoshikang Technology Co.Ltd, Yiyang 413000, China |
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| 中文摘要: |
| 目的 探究十二烷基硫酸钠(SDS)、十六烷基溴化吡啶(CPDB)和OP-10 3种表面活性剂在化学镀液中对镀镍过程的影响，改善PCB化学镀镍层的不均匀现象。方法 通过化学镀试验，对镀镍层的厚度变化进行研究。利用电化学分析测试，研究表面活性剂对化学镀镍腐蚀的影响。使用扫描电镜(SEM)对镀镍层表面微观形貌进行表征。运用Forcite模块中的COMPASS力场进行分子动力学计算，研究表面活性剂分子在镍层表面吸附过程中的能量变化。结果 通过化学镀试验，发现加入适量的表面活性剂能够增加镀镍层的厚度，SDS、CPDB和OP-10能够提高镀镍层的均匀性。电化学测试结果表明，3种表面活性剂与Cu-Ni表面吸附作用的强弱顺序为SDS>CPDB>OP-10。通过扫描电子显微镜测试，发现添加表面活性剂后，镀层表面平整性良好，颗粒分布和大小均匀，均匀性顺序为OP-10>CPDB>SDS，与镀速的变化呈负相关。分子动力学模拟计算结果表明，3种表面活性剂都能自发地吸附在镍表面，其温度波动和能量波动都在25 ps达到稳定，吸附稳定。OP-10、CPDB、SDS吸附模型作用能分别为–3338.61、–3681.28、–4158.18 kJ/mol。结论 在化学镀镍液中加入表面活性剂，可在一定程度上有效提高化学镀镍层的均匀性，并且提升镀镍速率。该研究为化学镀镍过程中表面活性剂的选择提供了理论基础。 |
| 英文摘要: |
| The work aims tostudy the effect of three surfactants, sodium dodecyl sulfate (SDS), cetyl pyridinium bromide (CPDB) and OP-10 on the nickel-plating process in electroless plating bath, to improve the unevenness of the PCB electroless nickel plating layer. The thickness change of the nickel plating layer was studied by electroless plating experiment. The effect of surfactants on the corrosion of the electroless nickel plating by electrochemical analysis test. Micro-topography of the nickel plating layer was characterized by scanning electron microscope (SEM). The molecular dynamics calculation was carried out by COMPASS force field in Forcite model to explore the adsorption process of surfactants on the surface of the nickel layer. The results of electroless plating experiments show that adding moderate surfactants can increase the thickness of the nickel-plated layer, and SDS, CPDB and OP-10 can improve the uniformity of the nickel-plated layer. Electrochemical test results demonstrated that the order of the adsorption of the three surfactants on the Cu-Ni layer is SDS>CPDB>OP-10. From the results of scanning electron microscope test, the coating has good flatness, the particle distribution and particle size are uniform after adding surfactant. The order of uniformity:OP-10>CPDB>SDS, which is negatively correlated with the change of plating speed. Molecular dynamics simulation calculation results show that the three surfactants can be spontaneously adsorbed to the surface of nickel, and their temperature fluctuations and energy fluctuations are both stable at 25 ps, and the adsorption is stable. The adsorption energy of OP-10, CPDB and SDS are –3338.61, –3681.28, –4158.18 kJ/mol respectively. Adding surfactants to the electroless nickel plating solution can effectively improve the uniformity of the electroless nickel plating layer and increase the nickel-plating rate. This study provides some theortical basis for the selection of surfactant in electroless nickel plating. |
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