尹韶辉,邓子默,郭源帆,刘坚,黄帅,尹建刚,卢建刚,彭博.单晶碳化硅的电磁场励磁大抛光模磁流变抛光[J].表面技术,2020,49(10):309-315.
YIN Shao-hui,DENG Zi-mo,GUO Yuan-fan,LIU Jian,HUANG Shuai,YIN Jian-gang,LU Jian-gang,PENG Bo.Magnetorheological Polishing Using Large Polishing Tool Excited by Electromagnetic Field for Silicon Carbide Wafer[J].Surface Technology,2020,49(10):309-315
单晶碳化硅的电磁场励磁大抛光模磁流变抛光
Magnetorheological Polishing Using Large Polishing Tool Excited by Electromagnetic Field for Silicon Carbide Wafer
投稿时间:2020-01-07  修订日期:2020-10-20
DOI:10.16490/j.cnki.issn.1001-3660.2020.10.036
中文关键词:  碳化硅晶片  磁流变抛光  大抛光模  表面粗糙度  电磁场
英文关键词:silicon carbide wafer  magnetorheological polishing  large polishing tool  surface roughness  electromagnetic field
基金项目:国家重点研发计划(2017YFE0116900);国家自然科学基金(51675171)
作者单位
尹韶辉 1.湖南大学 国家高效磨削工程技术研究中心,长沙 410082 
邓子默 1.湖南大学 国家高效磨削工程技术研究中心,长沙 410082 
郭源帆 1.湖南大学 国家高效磨削工程技术研究中心,长沙 410082 
刘坚 1.湖南大学 国家高效磨削工程技术研究中心,长沙 410082 
黄帅 1.湖南大学 国家高效磨削工程技术研究中心,长沙 410082 
尹建刚 2.大族激光科技产业集团股份有限公司,广东 深圳 518000 
卢建刚 2.大族激光科技产业集团股份有限公司,广东 深圳 518000 
彭博 3.中国电子科技集团公司第十三研究所,广东 深圳 050051 
AuthorInstitution
YIN Shao-hui 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China 
DENG Zi-mo 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China 
GUO Yuan-fan 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China 
LIU Jian 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China 
HUANG Shuai 1.National Engineering Research Center for High Efficiency Grinding, Hunan University, Changsha 410082, China 
YIN Jian-gang 2.Han’s Laser Technology Industry Group Co., Ltd, Shenzhen 518000, China 
LU Jian-gang 2.Han’s Laser Technology Industry Group Co., Ltd, Shenzhen 518000, China 
PENG Bo 3.The 13th Research Institute, China Electronics Technology Group Corporation, Shenzhen 050051, China 
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中文摘要:
      目的 研发一种高精高效单晶碳化硅表面抛光技术。方法 采用电磁场励磁的大抛光模磁流变抛光方法加工单晶碳化硅,利用自制的电磁铁励磁装置与磁流变抛光装置,进行单因素实验,研究电流强度、工作间隙和抛光时间等工艺参数对单晶碳化硅磁流变抛光加工性能的影响,并检测加工面粗糙度及其变化率来分析抛光效果。结果 在工作间隙1.4 mm、电流强度12 A的工艺参数下,加工面粗糙度值随着加工时间的增加而降低,抛光60 min后,加工面粗糙度值Ra达到0.9 nm,变化率达到98.3%。加工面粗糙度值随通电电流的增大而减小,随着工作间隙的增大而增大。在工作间隙为1.0 mm、通电电流为16 A、加工时间为40 min的优化参数下抛光单晶碳化硅,可获得表面粗糙度Ra为0.6 nm的超光滑表面。结论 应用电磁场励磁的大抛光模盘式磁流变抛光方法加工单晶碳化硅材料,能够获得亚纳米级表面粗糙度。
英文摘要:
      The work aims to develop a high precision and efficiency polishing technique for single-crystal silicon carbide surface. Single crystal silicon carbide was polished by a magnetorheological polishing method using a large polishing tool excited by an electromagnetic field. The self-developed electromagnet excitation device and magnetorheological polishing device were used for single-factor experiments. Effects of process parameters such as current intensity, working gap and polishing time on polishing performance were studied. The roughness of polished surface and its rate of change were analyzed to investigate the polishing effect. Under the process parameters of working gap of 1.4 mm and current strength of 12 A, the roughness value of the polished surface decreased with the increase of polishing time. After 60 min, the roughness value of the polished surface reached Ra 0.9 nm, and the rate of change reached 98.3%. The roughness of the polished surface decreased with the increase of the current, and increased with the increase of the working gap. Under optimized parameters of the working gap of 1.0 mm, the energized current of 16 A and the processing time of 40 min, an ultra-smooth surface of single crystal silicon carbide was obtained with surface roughness of Ra 0.6 nm. The sub-nanometer surface roughness of single crystal silicon carbide materials can be obtained by the method of magnetorheological polishing using large polishing tool excited by electromagnetic field.
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