张路路,朱明,张慧慧.工艺参数对铜锰合金镀层组织和成分的影响[J].表面技术,2017,46(4):150-156.
ZHANG Lu-lu,ZHU Ming,ZHANG Hui-hui.Influence of Process Parameters on Microstructure and Composition of Cu-Mn Alloy Coating[J].Surface Technology,2017,46(4):150-156 |
| 工艺参数对铜锰合金镀层组织和成分的影响 |
| Influence of Process Parameters on Microstructure and Composition of Cu-Mn Alloy Coating |
| 投稿时间：2016-12-17 修订日期：2017-04-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2017.04.025 |
| 中文关键词: 电镀 Cu-Mn合金镀层 电流密度 pH值 微观形貌 |
| 英文关键词:electroplating Cu-Mn alloy layer current density pH value microstructure |
| 基金项目:国家自然科学基金（51201131）；陕西省青年科技新星项目（2013KJXX-42）；西安科技大学培育基金（6310214005）；西安科技大学博士启动金（6310115012） |
| 作者 | 单位 |
| 张路路 | 西安科技大学 材料科学与工程学院，西安 710054 |
| 朱明 | 西安科技大学 材料科学与工程学院，西安 710054 |
| 张慧慧 | 西安科技大学 材料科学与工程学院，西安 710054 |
|
| Author | Institution |
| ZHANG Lu-lu | School of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China |
| ZHU Ming | School of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China |
| ZHANG Hui-hui | School of Materials Science and Engineering, Xi'an University of Science and Technology, Xi'an 710054, China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 目的 在基体表面制备出均匀平整、致密且与基体结合良好的合金镀层，合金镀层中Mn的原子数分数达20%以上。方法 用电沉积方法以氯酸盐体系，用EDTANa2作为络合剂，在SUS430不锈钢表面制备了Cu-Mn合金镀层，利用SEM及EDS研究了镀层的微观形貌及成分变化，分析了电流密度、pH值、沉积时间、电解液中n(Cu):n(Mn)比等参数对镀层微观结构和成分的影响。结果 电流密度为200~700 mA/cm2、pH值为3~7、时间为10~30 min和n(Cu):n(Mn)比为1:20~1:10时，镀层中的Mn含量随电流密度、pH值及时间的增大而增大，随着n(Cu):n(Mn)比值的增大而减小。结论 电镀Cu-Mn合金的优化工艺参数是：电流密度为500 mA/cm2，pH值为5，时间为20 min，n(Cu):n(Mn)比为1:10。此时能够得到均匀、致密、与基体结合良好的合金镀层，且合金镀层中Mn的原子数分数能达到20%以上。质量良好的Cu-Mn合金镀层在固体氧化物燃料电池中具有潜在的应用价值。 |
| 英文摘要: |
| The work aims to prepare a uniform, smooth, compact and adhesive alloy coating on the surface of substrate with Mn atomicity fraction of over 20%, which had a good compatibility to the substrate. Cu-Mn alloy coating was prepared on SUS430 stainless steel in electrodeposition method in chlorate system with EDTANa2 as complexing agent. Morphology and composition variation of the coating were studied with SEM and EDS. Effects of parameters including current density, pH value, deposition time and n(Cu):n(Mn) ratio in the electrolyte on microstructure and composition of the Cu-Mn layer were analyzed. the Mn content in the coating increased with current density, pH value or deposition time provided with current density of 200~700 mA/cm2, pH value of 3~7, deposition time of 10~30 min and n(Cu):n(Mn) ratio of 1:20~1:10, and decreased with n(Cu):n(Mn) ratio. Optimal process parameters of Cu-Mn alloy electroplating are as follows: current density of 500 mA/cm2, pH value of 5, deposition time of 20 min and n(Cu):n(Mn) ratio of 1:10. A uniform, smooth, compact and adhesive alloy coating with Mn content above 20% (atomic fraction) can be prepared. The excellent Cu-Mn alloy coating is of potential application value in solid oxide fuel cell. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号