吴书安,祝锡晶,王建青,郭策.单磨粒对硬脆性材料延性去除的建模分析[J].表面技术,2016,45(5):219-223.
WU Shu-an,ZHU Xi-jing,WANG Jian-qing,GUO Ce.Modelling Analysis on Ductile Removal of Hard-brittle Material by Single Grain[J].Surface Technology,2016,45(5):219-223
单磨粒对硬脆性材料延性去除的建模分析
Modelling Analysis on Ductile Removal of Hard-brittle Material by Single Grain
投稿时间:2016-02-28  修订日期:2016-05-20
DOI:10.16490/j.cnki.issn.1001-3660.2016.05.034
中文关键词:  单磨粒  刃圆半径  磨削深度  半圆锥角  流动应力  延性去除  第一变形区
英文关键词:single grain  edge radius  grinding depth  semi cone angle  flow stress  ductile removal  the first deformational area
基金项目:国家自然科学基金项目(51275490);中北大学研究生科技基金项目(20151215)
作者单位
吴书安 中北大学,太原 030051 
祝锡晶 中北大学,太原 030051 
王建青 中北大学,太原 030051 
郭策 中北大学,太原 030051 
AuthorInstitution
WU Shu-an North University of China, Taiyuan 030051, China 
ZHU Xi-jing North University of China, Taiyuan 030051, China 
WANG Jian-qing North University of China, Taiyuan 030051, China 
GUO Ce North University of China, Taiyuan 030051, China 
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中文摘要:
      目的 硬脆性材料在珩磨时的脆性去除会使得被加工件的表面质量达不到更高的应用要求,同时对磨具磨损严重,通过理论建模研究珩磨过程中单磨粒磨削参数与切屑第一变形区流动应力的关系,并得到实现延性去除的各参数阈值。 方法 针对 304 不锈钢,通过对单磨粒划擦的分析,数学推导得出在平面情况下切屑第一变形区流动应力与单磨粒刃圆半径、 磨削深度以及半圆锥角的函数关系。结果 在完全刃圆磨削和复合磨削阶段都会有实现材料延性去除的现象被发现,并得到完全刃圆磨削时,取刃圆半径 r=1 μm,在磨削深度 h=0.07 μm,流动应力取得极大值 σ=227.7 MPa。复合磨削时,取半圆锥角 θ=30°, r<1.5 μm 时, r 的延性去除阈值为 0.3~1 μm。 当取 h=0.6 μm, θ 和 r 同样存在实现材料延性去除的阈值,分别为 45°~75°和 0.5 μm 左右。 结论 单磨粒刃圆半径、 磨削深度和半圆锥角使材料实现延性去除的阈值范围在理论上被确定,为硬脆性材料的延性去除理论的进一步研究提供参考。同时适当减小磨粒刃圆半径,取 45°~75°范围内的磨粒半圆锥角,使磨削深度增大,并实现材料的延性去除,可以提高材料的表面质量和磨削效率。
英文摘要:
      Objective Brittle removal of hard-brittle material in honing will lead to failure of the workpiece surface quality to meet higher application requirements, and cause serious abrasive wear at the same time. This paper aimed to study the relationship between the grinding parameters of single grain and flow stress in the first deformational area of chip in the honing process through theoretical modelling, and get the threshold of parameters in ductile removal. Methods For the 304 stainless steel, through analysis of the abrasive scratch caused by single grain, the function relationships between the flow stress in the first deformational area of chip and the single particle edge radius, the grinding depth and the semi cone angle in the plane case were derived by mathematics. Results The ductile removal for material was found in the complete edge grinding and the composite grinding stage. In complete edge grinding, under the condition of edge radius r=1 μm and grinding depth h=0.07 μm, the flow stress reached its maximum value of σ=227.7 MPa. In composite grinding, under the condition of semi cone angle θ=30° and r<1.5 μm, the ductile removal threshold was r=0.3~1 μm; when h=0.6 μm, the thresholds of θ and r to achieve the ductile removal for material also existed, which were 45°~75° and about 0.5 μm, respectively. Conclusion The threshold ranges of single abrasive grain edge radius, the grinding depth and semi cone angle for the ductile removal of material were determined in theory, which provides reference for the further study of the ductile removal theory in hard-brittle material. At the same time, the edge radius of grain should be appropriately reduced, and the semi cone angle should be set in the range of 45°~75°, so as to increase the grinding depth, realize the ducticle removal of material, and improve the surface quality and the grinding efficiency of material.
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