方华,李晔,郭方松,姜赫.不同密度研磨介质球对机械研磨电镀铜镀层耐蚀性能影响[J].表面技术,2016,45(5):143-148.
FANG Hua,LI Ye,GUO Fang-song,JIANG He.Effect of Grinding Media Ball with Different Densities on Corrosion Resistance of Mechanical Attrition Electroplated Cu Coating[J].Surface Technology,2016,45(5):143-148
不同密度研磨介质球对机械研磨电镀铜镀层耐蚀性能影响
Effect of Grinding Media Ball with Different Densities on Corrosion Resistance of Mechanical Attrition Electroplated Cu Coating
投稿时间:2016-02-19  修订日期:2016-05-20
DOI:10.16490/j.cnki.issn.1001-3660.2016.05.022
中文关键词:  机械研磨  铜镀层  介质球密度  晶胞细化  耐蚀性
英文关键词:mechanical polishing  Cu coating  medium ball density  unit cell refinement  corrosion resistance
基金项目:
作者单位
方华 东北石油大学 机械科学工程学院,黑龙江 大庆 163000 
李晔 东北石油大学 机械科学工程学院,黑龙江 大庆 163000 
郭方松 东北石油大学 机械科学工程学院,黑龙江 大庆 163000 
姜赫 大庆师范学院 机电工程学院,黑龙江 大庆 163000 
AuthorInstitution
FANG Hua Mechanical Science and Engineering College, Northeast Petroleum University, Daqing 163000, China 
LI Ye Mechanical Science and Engineering College, Northeast Petroleum University, Daqing 163000, China 
GUO Fang-song Mechanical Science and Engineering College, Northeast Petroleum University, Daqing 163000, China 
JIANG He Electromechanic Engineering College, Daqing Normal University, Daqing 163000, China 
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中文摘要:
      目的 利用垂直冲击电镀装置制备机械研磨电镀铜镀层。 方法 在普通酸性镀铜液中分别加入玻璃球、铜球、铅球,在垂直冲击电镀装置振幅为 4 mm、 频率为 12 Hz 的情况下制备 30 μm 的铜镀层,利用电子扫描电镜(SEM)观察镀层表面微观形貌,研究不同密度研磨介质球对镀层晶胞大小的影响;利用恒电位仪测量机械研磨电镀过程中的阴极极化程度,研究机械研磨电镀晶胞细化机制;利用失重法测试镀层在 3.5%(质量分数) 的 NaCl 溶液中的腐蚀速度,研究介质球密度与铜镀层腐蚀速度之间的关系;利用电化学测试技术验证介质球密度与铜镀层腐蚀速度之间关系的一致性。 结果 与普通铜镀层相比,机械研磨铜镀层晶胞细小,耐蚀性较好; 铅球机械研磨铜镀层晶胞最小,耐蚀性最好; 铜球机械研磨铜镀层晶胞次之,耐蚀性次之; 玻璃球机械研磨铜镀层晶胞最大,耐蚀性最差。 结论 介质球密度为(2~12.3)×103 kg/m3时,随着介质球密度的增大,铜镀层晶胞减小,耐蚀性提高。
英文摘要:
      Objective To polish plating copper coatings by vertical impact electroplating device. Methods Glass ball, copper ball and lead ball were added to acid copper plating solution. Copper plating coatings with a thickness of 30 μm were prepared when the swing of the vertical impact electroplating device was 4 mm and its frequency was 12 Hz. Scanning electron microscopy (SEM) was used to observe the microstructure of the plating surface and study the effect of grinding media ball with different densities on unit cell size. The refinement mechanism mechanical grinding electroplating cell was studied by measuring the cathodic polarization degree in the process of mechanical polishing plating using potentiostat. The corrosion speed of plating in 3.5% NaCl solution of mass fraction was tested using gravity losing method to study the relationship between medium ball density and corrosion speed of copper plating. The relationship between medium ball density and corrosion speed of copper plating was verified employing electrochemical measurement technology. Results Compared with the ordinary coating, the crystal cells of mechanical polishing copper plating were smaller and the corrosion resistance was better. According to the test results, the crystal cells of mechanical polishing copper plating using lead ball were the smallest and the corrosion resistance was the best. The crystal cells of copper ball mechanical polishing copper plating and the corresponding corrosion resistance took the second place. The crystal cells of glass ball mechanical polishing copper plating were the largest and the corrosion resistance was the worst. Conclusion The smaller the copper plating cell was, the better corrosion resistance was as the density of medium ball increased in certain density range (2~12.3)×103 kg/m3.
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