宋卿,张永俊,于兆勤,王冠.模具钢微细蚀刻速率的研究[J].表面技术,2013,42(6):40-43.
SONG Qing,ZHANG Yong-jun,YU Zhao-qin,WANG Guan.Study on Etching Rate of Die Steel in Micro-etching[J].Surface Technology,2013,42(6):40-43
模具钢微细蚀刻速率的研究
Study on Etching Rate of Die Steel in Micro-etching
投稿时间:2013-06-20  修订日期:2013-07-04
DOI:
中文关键词:  微细蚀刻  模具钢  蚀刻速率
英文关键词:micro-etching  die steel  etching rate
基金项目:国家自然科学基金重点资助项目( U1134003) ;国家青年科学基金资助项目( 51205066 ) ;广东省自然科学基金资助项目( s2012010009022)
作者单位
宋卿 广东工业大学 机电学院, 广州 510006 
张永俊 广东工业大学 机电学院, 广州 510006 
于兆勤 广东工业大学 机电学院, 广州 510006 
王冠 广东工业大学 机电学院, 广州 510006 
AuthorInstitution
SONG Qing Institute of Mechatronics, Guangdong University of Technology, Guangzhou 510006, China 
ZHANG Yong-jun Institute of Mechatronics, Guangdong University of Technology, Guangzhou 510006, China 
YU Zhao-qin Institute of Mechatronics, Guangdong University of Technology, Guangzhou 510006, China 
WANG Guan Institute of Mechatronics, Guangdong University of Technology, Guangzhou 510006, China 
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中文摘要:
      目的 研究模具钢微细蚀刻中,蚀刻速率的变化规律。 方法 采用蚀刻液喷淋加工方式,对掩膜的模具钢表面进行蚀刻,考察掩膜间隙、蚀刻液喷淋压力、蚀刻液温度对蚀刻速率的影响。 结果 蚀刻速率随掩膜间隙尺寸的增大而增加,当掩膜尺寸大于 150 μm 时,蚀刻速率增长较快;较大的喷淋压力有利于蚀刻液的更新和蚀刻产物的排除,使得蚀刻反应充分,蚀刻速率较高;温度在一定范围内升高,蚀刻液活性增大,蚀刻效率提高,蚀刻速率增大。 结论 最佳工艺条件为:掩膜间隙尺寸 150 ~ 200 μm,蚀刻液喷淋压力 1 . 0 ~ 1 . 4 MPa,蚀刻液温度 35 ~ 40 ℃ 。 在此加工条件下,模具钢的蚀刻速率高,加工效率高,同时可以保证较好的蚀刻尺寸精度。
英文摘要:
      Objective The variation of etching rate in micro-etching on the die steel was studied. Methods Spray etching was used in etching the surface of the die steel with mask processing. The impact of the mask gap width, spray pressure and etchant temperature on the etching rate was investigated. Results The etching rate increased with the increasing mask gap width, when the mask gap was wider than 150 μm, the etching rate increased rapidly. Larger spray pressure was benefit for updating the etchant and excluding the etching product, when the reaction was sufficient, the etching rate increased. When the etchant temperature elevated within a certain range, the etchant activity increased, so as the etching efficiency and the etching rate. Conclusion The optimal condition was a mask gap width of 150 ~ 200 μm, a spray pressure of 1. 0 ~ 1. 4 MPa, amd an etchant temperature of 35 ~ 40 ℃ . Under this condition, the etching rate and the processing efficiency were both high. Meanwhile, it helped to ensure a higher dimensional accuracy.
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