王星星,龙伟民,吕登峰,鲍丽,齐剑钊,孙华为.工艺条件对 BAg50 CuZn 钎料表面电镀锡溶液电阻的影响[J].表面技术,2013,42(4):76-78,118.
WANG Xing-xing,LONG Wei-min,LYU Deng-feng,BAO Li,QI Jian-zhao,SUN Hua-wei.Effect of Technological Condition on Resistance of Electroplating Tin Solution Based on BAg50 CuZn Brazing Filler Metal[J].Surface Technology,2013,42(4):76-78,118 |
| 工艺条件对 BAg50 CuZn 钎料表面电镀锡溶液电阻的影响 |
| Effect of Technological Condition on Resistance of Electroplating Tin Solution Based on BAg50 CuZn Brazing Filler Metal |
| 投稿时间：2013-03-02 修订日期：2013-04-10 |
| DOI： |
| 中文关键词: BAg50 CuZn 钎料 电镀锡 电解液电阻 超声波 |
| 英文关键词:BAg50 CuZn brazing filler metal electroplating tin electrolyte resistance ultrasonic |
| 基金项目:国家高技术研究发展计划项目(2012AA040208) ;国家重点基础研究发展计划项目(2012CB723902) ;郑州市重大科技专项(121PZDZX001) |
| 作者 | 单位 |
| 王星星 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
| 龙伟民 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
| 吕登峰 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
| 鲍丽 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
| 齐剑钊 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
| 孙华为 | 郑州机械研究所 新型钎焊材料与技术国家重点实验室, 郑州 450001 |
|
| Author | Institution |
| WANG Xing-xing | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
| LONG Wei-min | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
| LYU Deng-feng | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
| BAO Li | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
| QI Jian-zhao | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
| SUN Hua-wei | State Key Laboratory of Advanced Brazing Filler Metals and Technology,Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001 , China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 采用硫酸盐系电解液在 BAg50 CuZn 钎料表面电镀 Sn,考察了电流密度、镀液温度、阴阳极间距、超声波功率及超声波频率对 AgCuZn 钎料电镀锡溶液电阻的影响,得出了较佳的工艺条件,并对该条件下制备的锡电镀层的微观表面形貌进行了观察。 结果表明,施镀时间一定时,随着电流密度或超声波频率的增大,溶液电阻逐渐增大;阴阳极间距增大时,溶液电阻呈现先减小、后增大的趋势。 在较佳工艺条件下施镀,可获得表面平整、致密的 Sn 电镀层。 |
| 英文摘要: |
| Tin films were electroplated on BAg50 CuZn brazing filler metal substrate using sulfate salt electrolyte. The effect of current density, bath temperature, electrode distance, ultrasonic power and frequency on resistance of tin electroplating electrolyte were analyzed. The better conditions of electroplating tin on AgCuZn brazing filler metal were obtained. The surface morphology of tin electroplating coating was examed. The results indicate that the electrolyte resistance increase with increasing of current density and ultrasonic frequency. The resistance decreases firstly and then increases with increasing of electrode distance. A smooth and uniform surface morphology of tin electroplated film is obtained under the better conditions. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号