陈雷,陈国辉,江文辉,林贤清.Si-69应用于2024铝合金表面硅烷化防腐蚀处理的工艺研究[J].表面技术,2012,(1):79-82,105.
CHEN Lei,CNEN Guo-hui,JIANG Wen-hui,LIN Xian-qing.Studies on Silane-based Anti-corrosion Surface Treatment of Aluminum Alloy 2024[J].Surface Technology,2012,(1):79-82,105 |
| Si-69应用于2024铝合金表面硅烷化防腐蚀处理的工艺研究 |
| Studies on Silane-based Anti-corrosion Surface Treatment of Aluminum Alloy 2024 |
| 投稿时间：2011-10-14 修订日期：2012-02-20 |
| DOI： |
| 中文关键词: 2024铝合金 Si-69 硅烷膜 耐蚀性 |
| 英文关键词:aluminum alloy 2024 Si-69 silane films corrosion resistance |
| 基金项目: |
| 作者 | 单位 |
| 陈雷 | 中南大学化学化工学院,长沙410083 |
| 陈国辉 | 中南大学化学化工学院,长沙410083 |
| 江文辉 | 中南大学化学化工学院,长沙410083 |
| 林贤清 | 中南大学化学化工学院,长沙410083 |
|
| Author | Institution |
| CHEN Lei | Department of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China |
| CNEN Guo-hui | Department of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China |
| JIANG Wen-hui | Department of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China |
| LIN Xian-qing | Department of Chemistry and Chemical Engineering, Central South University, Changsha 410083, China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 采用正交试验探索硅烷偶联剂Si-69的水解工艺条件,研究了Si-69用量、水解pH 值、水解时间等水解因素和老化成膜条件(温度、时间)对硅烷成膜试样耐蚀性的影响,确定了最佳水解工艺和老化成膜工艺。经电化学测试表明,硅烷膜的生成使2024铝合金基体表面的多孔性降低,有效阻止了腐蚀介质所参与的阴极活性点还原反应,极大地提高了基体的耐蚀性。 |
| 英文摘要: |
| The hydrolysis conditions of 3,3'-bis[triethoxysilylpropyl]tetrasulfide (Si-69) were probed by the orthogonal design. The influence of film-forming factors such as the dosage of Si-69, the PH value of hydrolization, the time of hydrolization, the aging time and the aging temperature on the corrosion resistance of silane films was also studied. The best anti-corrosion technology was systematically identified. The electrochemical tests showed that the silane films effectively reduced the surface porosity of aluminum 2024 and prevented the cathode active sites reduction reaction which the corrosion particles participated in. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号