李丽,吴卫,张尧成.磁控溅射中溅射电流对Ti薄膜膜基结合性能的影响[J].表面技术,2010,39(5):92-94.
LI Li,WU Wei,ZHANG Yao-cheng.Effect of Sputtering Current on Adhesion Strength of Ti Film Deposited by Magnetron Sputtering[J].Surface Technology,2010,39(5):92-94 |
| 磁控溅射中溅射电流对Ti薄膜膜基结合性能的影响 |
| Effect of Sputtering Current on Adhesion Strength of Ti Film Deposited by Magnetron Sputtering |
| 投稿时间：2010-07-17 修订日期：2010-10-10 |
| DOI： |
| 中文关键词: Ti膜 磁控溅射 溅射电流 附着强度 |
| 英文关键词:Ti film magnetron sputtering sputtering current adhesion strength |
| 基金项目: |
|
|
|
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 研究在磁控溅射工艺中工作压强和溅射时间恒定的情况下,溅射电流的变化对钛膜与基底Gd结合能力的影响。通过拉伸法测量薄膜与基体间的附着强度,利用扫描电镜观察Ti膜表面形貌。结果表明:溅射电流达到3 A时,Ti膜表面平整,与基体的结合力最强。由此说明,溅射电流的变化对钛膜与基底Gd结合能力的影响较大。 |
| 英文摘要: |
| The effect of sputtering current on adhesion strength of Ti film and Gd basis when the working pressure and time is constant was discussed. The adhesion strength between the film and the basis was tested by tension test, and the surface was investigated by SEM. The results show that when the sputtering current reachs 3 A, the surface of the Ti film is smooth, and the adhesion strength with the matrix is the strongest. It can be concluded that the variation of the sputtering current has prominent effect on the adhesion strength between the Ti film and the Gd. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号