吕小莉,冯长杰,钟小荣,万小欢,杜楠.水平震荡机械研磨电镀铜工艺研究[J].表面技术,2010,39(3):74-77.
LV Xiao-li,FENG Chang-jie,ZHONG Xiao-rong,WAN Xiao-huan,DU Nan.Study on the Process of Horizontally Vibrating Mechanical Attrition Electroplating Cu Coatings[J].Surface Technology,2010,39(3):74-77 |
| 水平震荡机械研磨电镀铜工艺研究 |
| Study on the Process of Horizontally Vibrating Mechanical Attrition Electroplating Cu Coatings |
| 投稿时间：2010-01-29 修订日期：2010-06-10 |
| DOI： |
| 中文关键词: 水平震荡 机械研磨 电沉积 镀铜 镀层结构 |
| 英文关键词:horizontally vibrating mechanical attrition electrodeposition Cu coating microstructure process |
| 基金项目:江西省自然科学基金资助项目(2008GQC0038) |
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| Author | Institution |
| LV Xiao-li | Nanchang Hangkong University, Nanchang 330063, China |
| FENG Chang-jie | Nanchang Hangkong University, Nanchang 330063, China |
| ZHONG Xiao-rong | Nanchang Hangkong University, Nanchang 330063, China |
| WAN Xiao-huan | Nanchang Hangkong University, Nanchang 330063, China |
| DU Nan | Nanchang Hangkong University, Nanchang 330063, China |
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| 中文摘要: |
| 在传统酸性镀铜液中加入玻璃球,利用SEM和XRD考察了玻璃球数量与震荡频率对机械研磨电镀工艺的影响,并探讨了水平震荡频率和玻璃球数量对镀层微观结构的影响机理。实验结果表明:固定玻璃球数量为80个,震荡频率为2.5～ 4.2 Hz时,所得镀层的晶粒尺寸随着震荡频率的增加而显著降低;固定水平震荡频率为4.2 Hz,玻璃球数量为40～ 120个时,随着玻璃球数量的增加,所得镀层的晶粒尺寸先降低后略有增大,但仍明显小于传统镀层;水平震荡机械研磨电镀铜层具有(111)择优取向,但择优取向程度受水平震荡条件影响。 |
| 英文摘要: |
| The mechanical attrition was supplied in a traditional acid electroplating process of Cu. The effects of the number of the glass balls and their vibrating frequency on the microstructure of the mechanical attrition electroplating were analyzed by SEM and XRD. The results show that, compared with the traditional electroplated Cu coating, when the number of glass balls is 80 and vibrating are set to 2.5 to 4.2 Hz, the grain size of the Cu coatings decrease significantly with the increase of vibrating frequency. And when the vibrating frequency is set to 4.2 Hz and the number of the glass balls is 40 to 120, with the increase of the number of glass balls, the grain size of the Cu coatings decrease initially and then slightly increase, but still smaller than that of traditional electroplated Cu coating. Horizontally vibrating mechanical attrition electroplating Cu coatings have(111)preferred orientation, but their extents are influenced by the vibrating conditions. |
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