吴春,刘祥萱,蒋大勇,梁剑涛,吴友朋.金属铜薄膜的制备与红外发射率特性研究[J].表面技术,2010,39(2):34-37.
WU Chun,LIU Xiang-xuan,JIANG Da-yong,LIANG Jian-tao,WU You-peng.Preparation of Metal Cu Film and the Research of the Infrared Emissivity Properties[J].Surface Technology,2010,39(2):34-37 |
| 金属铜薄膜的制备与红外发射率特性研究 |
| Preparation of Metal Cu Film and the Research of the Infrared Emissivity Properties |
| 投稿时间：2009-11-19 修订日期：2010-04-10 |
| DOI： |
| 中文关键词: 铜薄膜 化学镀 电阻率 红外发射率 |
| 英文关键词:Cu film electroless plating resistivity infrared emissivity |
| 基金项目: |
| 作者 | 单位 |
| 吴春 | 西安第二炮兵工程学院,西安710025 |
| 刘祥萱 | 西安第二炮兵工程学院,西安710025 |
| 蒋大勇 | 西安第二炮兵工程学院,西安710025 |
| 梁剑涛 | 西安第二炮兵工程学院,西安710025 |
| 吴友朋 | 西安第二炮兵工程学院,西安710025 |
|
| Author | Institution |
| WU Chun | The Second Artillery Engineering Institute of Xi'an, Xi'an 710025, China |
| LIU Xiang-xuan | The Second Artillery Engineering Institute of Xi'an, Xi'an 710025, China |
| JIANG Da-yong | The Second Artillery Engineering Institute of Xi'an, Xi'an 710025, China |
| LIANG Jian-tao | The Second Artillery Engineering Institute of Xi'an, Xi'an 710025, China |
| WU You-peng | The Second Artillery Engineering Institute of Xi'an, Xi'an 710025, China |
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| 中文摘要: |
| 利用化学镀铜工艺,以次亚磷酸钠为还原剂,在普通平板玻璃表面制备了金属铜薄膜。用扫描电子显微镜,X射线衍射仪,四探针电阻仪,红外光谱辐射计等对薄膜的表面形貌、晶体结构和光电特性进行了表征,重点研究了金属铜膜的红外发射率与波长以及电阻率的变化关系,并与经典的Hagen-Rubens关系式进行了对比。结果表明:铜膜的发射率随波长的增大而降低,在特定的波段,发射率随电阻率的升高而增大。 |
| 英文摘要: |
| Metal Cu films were prepared on plate glass by an electroless plating technique with sodium hypophosphite as a reducing agent. The morphologies of surface, crystalline structure and optoelectronic properties were characterized by SEM, XRD, four-point probe resistance test system and infrared spectrum radiometer. The resent paper paid more attention to study the change relation ofinfrared emissivity and resistivity of metalCu films as well as the wavelength,and also has been compared with the classics Hagen-Ruben' s relation. The result indicates that the emissivity of Cu film reduces along with enlarging of wavelength, at the special band, the emissivity increases along with increasing of resistivity. |
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