洪逸,张晓燕,李广宇,马小东,敖启艳.Cu-W复合电沉积工艺研究[J].表面技术,2008,37(5):64-65,84.
HONG Yi,ZHANG Xiao-yan,LI Guang-yu,MA Xiao-dong,AO Qi-yan.Study on Cu-W Composite Electroplating Process[J].Surface Technology,2008,37(5):64-65,84 |
| Cu-W复合电沉积工艺研究 |
| Study on Cu-W Composite Electroplating Process |
| 投稿时间：2008-07-07 修订日期：2008-10-10 |
| DOI： |
| 中文关键词: 复合电沉积 复合镀层 工艺参数 电接触材料 铜钨合金 |
| 英文关键词:Composite electrodeposition Composite deposits Process parameter Electrical contact material Cu-W alloy |
| 基金项目:贵州大学大学生创新性实验计划项目( 2007 -004) |
| 作者 | 单位 |
| 洪逸 | 贵州大学材料科学与冶金工程学院，贵州贵阳550003 |
| 张晓燕 | 1．贵州大学材料科学与冶金工程学院，贵州贵阳550003；2.贵州省材料结构与强度重点实验室，贵州贵阳550003 |
| 李广宇 | 贵州大学材料科学与冶金工程学院，贵州贵阳550003 |
| 马小东 | 贵州大学材料科学与冶金工程学院，贵州贵阳550003 |
| 敖启艳 | 贵州大学材料科学与冶金工程学院，贵州贵阳550003 |
|
| Author | Institution |
| HONG Yi | School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China |
| ZHANG Xiao-yan | 1. School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China;2. Guizhou Key Laboratory for Mechanical Behavior and Microstructure of Materials, Guizhou University, Guiyang 550003, China |
| LI Guang-yu | School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China |
| MA Xiao-dong | School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China |
| AO Qi-yan | School of Materials Science and Metallurgical Engineering, Guizhou University, Guiyang 550003, China |
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| 中文摘要: |
| 电接触材料要求具有很好的抗电弧烧蚀和抗熔焊性能，但纯铜很难达到该种要求。利用复合电沉积方法，在纯铜表面形成Cu-W复合镀层，使其满足电触头材料的使用性能。重点研究了镀液中W的质量浓度、电流密度、搅拌强度和温度工艺参数对Cu-W电接触材料复合镀层中W微粒沉积量的影响，并且通过正交试验确定了复合电沉积的最优工艺：W的质量浓度为35g/L、电流密度为4A/dm2、搅拌强度为600r/min、温度为50℃。 |
| 英文摘要: |
| Contact materials are demanded to have finer electric erosion resistance and anti-welding properties, but pure copper cant meet the requirement easily. The Cu-W composite deposits was formed on the surface of pure copper by composite electro deposition, to meet the service performance of contact material. The influence of W particulate content in Cu-W composite deposits including W mass concentration, current density, stimng intention and temperature on W particulate content in Cu-W composite deposits was laid special stress on, and the optimum process parameters for composite electrodeposition were determined by orthogonal experimentations. And the optimal process: W mass concentration 35 g/L, current density 4A/dm2 , stimng intention 600 r/min, the temperature of 500℃. |
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