吴赣红,李德良,董坤,曹璟.一种无氰化学镀金工艺的研究[J].表面技术,2008,37(3):52-54,86.
WU Gan-hong,LI De-Liang,DONG Kun,CAO Jing.Technology Research about Non-cyanide Gold Plating[J].Surface Technology,2008,37(3):52-54,86 |
| 一种无氰化学镀金工艺的研究 |
| Technology Research about Non-cyanide Gold Plating |
| 投稿时间：2008-02-23 修订日期：2008-06-10 |
| DOI： |
| 中文关键词: 无氰化学键 亚硫酸金钠 化学镀金 |
| 英文关键词:Non-cyanide electroless plating Sodium gold sulfite Electroless gold plating |
| 基金项目:国家教委留学回国人员资助项目( 2004184) |
|
|
| Author | Institution |
| WU Gan-hong | School of Resource and Environment, CSFTU, Changsha 410004, China |
| LI De-Liang | School of Resource and Environment, CSFTU, Changsha 410004, China |
| DONG Kun | School of Resource and Environment, CSFTU, Changsha 410004, China |
| CAO Jing | School of Resource and Environment, CSFTU, Changsha 410004, China |
|
| 摘要点击次数: |
| 全文下载次数: |
| 中文摘要: |
| 为了确定一种无氰亚硫酸金钠化学镀金的最佳工艺条件，并使其具有工业上的可行性，利用镀层厚度测试和镀层结合力测试等性能检测手段，研究了该工艺中镀液组分和操作条件对镀层的影响。结果表明：当溶液中亚硫酸金钠（以金计）为1～3 g/L，亚硫酸钠为13g/L，按乙二胺/Au= (6—10):1比例投入，磷酸氢二钾为30g/L，pH为8~9，温度为50—60℃时，可以得到光亮均匀的镀金层。 |
| 英文摘要: |
| In order to determine optimum conditions of a cyanide-free sodium gold sulfite electroless gold plating process and make its have industrial possibility, the effects of solution components and operative condition of this cyanide-free electroless gold plating on coating were studied by coating thickness test and coating binding force test. The results show that an optimal condition of the process can prepare a smooth gold coating. The optimized factors are as follows: gold concentration is l N 3g/L; sodium sulfite concentration is 13g/L; molar ration of ethylenediamine and gold ion is (6 ~ 10) :1 ,potassium phosphate dibasic concentration is 30g/L,the pH value is 8 ~ 9,the temperature is 50 ~ 60℃. |
| 查看全文 查看/发表评论 下载PDF阅读器 |
| 关闭 |
|
|
|
渝公网安备 50010702501715号