彭舒,唐振方,吉锐.电子浆料中微米级铜粉的抗氧化研究[J].表面技术,2008,37(3):6-8.
PENG Shu,TANG Zhen-fang,JI Rui.Study on the Anti-oxidation Capability of Micro Copper Powder in Organic Medium[J].Surface Technology,2008,37(3):6-8 |
| 电子浆料中微米级铜粉的抗氧化研究 |
| Study on the Anti-oxidation Capability of Micro Copper Powder in Organic Medium |
| 投稿时间：2008-03-07 修订日期：2008-06-10 |
| DOI： |
| 中文关键词: 电子浆料 镀银铜粉 有机膜 抗氧化性 |
| 英文关键词:Isotropic conductive adhesive Silver plated copper powder Organic film Oxidation resistance |
| 基金项目: |
| 作者 | 单位 |
| 彭舒 | 暨南大学物理系，广东广州510632 |
| 唐振方 | 暨南大学物理系，广东广州510632 |
| 吉锐 | 暨南大学物理系，广东广州510632 |
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| Author | Institution |
| PENG Shu | Department of Physics, Jinan University, Guangzhou 510632, China |
| TANG Zhen-fang | Department of Physics, Jinan University, Guangzhou 510632, China |
| JI Rui | Department of Physics, Jinan University, Guangzhou 510632, China |
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| 摘要点击次数: |
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| 中文摘要: |
| 为了防止电子浆料的氧化问题，采用表面涂覆一种特殊有机膜的方法对电子浆料中微米级铜粉及镀银铜粉进行抗氧化处理，通过SEM、XRD、TG及加速老化试验等手段对其进行了表征和分析。结果表明：经过表面镀银及涂覆有机膜双重处理后的微米级导电铜粉抗氧化性能有明显的提高。 |
| 英文摘要: |
| A special organic film was coated on the surface of the micro copper powder and the silver-plated copper powder in isotropic conductive adhesive to anti-oxidize them and the anti-oxidize capacities of products were tested though scanning electronic microscope analysis, X-ray diffraction analysis, thermal gravimetric analysis, accelerated aging test and electric conductivity test. The results show that the micro conductive copper powdr treated silve plating and covered with organic fiml has optimal anti-oxidation capacity. |
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