魏喆良.基于电偶电流的铜基材浸镀银工艺设计[J].表面技术,2007,36(6):81-82,96.
WEI Zhe-liang.Technology Design of Immersion Silver Plating onto Copper Substrate Based on Galvanic Current[J].Surface Technology,2007,36(6):81-82,96 |
| 基于电偶电流的铜基材浸镀银工艺设计 |
| Technology Design of Immersion Silver Plating onto Copper Substrate Based on Galvanic Current |
| 投稿时间：2007-07-24 修订日期：2007-12-10 |
| DOI： |
| 中文关键词: 浸镀银 电偶电流 置换反应 乙二胺 |
| 英文关键词:Immersion silver Calvanic current Displacement Ethylenediamine |
| 基金项目:福建省纳米研究专项资助项目( 2005 HZOI_2-7) |
| 作者 | 单位 |
| 魏喆良 | 福州大学机械工程及自动化学院，福建福州350108 |
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| Author | Institution |
| WEI Zhe-liang | College of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350108, China |
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| 中文摘要: |
| 利用先进的电化学工作站，通过测定不同工艺条件下的铜银电偶电流·时间曲线，对乙二胺络合体系下铜基材浸镀银的工艺参数进行设计和优化。结果表明：根据电偶电流一时间曲线上是否出现“沉积电流墙“以及残余电偶电流的大小，可以快速、直观地筛选出合适的浸镀银工艺参数。用市售铜箔进行现场浸镀发现，基于电偶电流所设计的浸镀工艺参数（溶液中银离子质量浓度为3g/L，银离子与乙二胺的摩尔比为1：5，溶液pH值为11.3），可以在铜箔表面浸镀上均匀致密的银镀层。 |
| 英文摘要: |
| The technology of immersion silver(l-Ag) plating onto copper substrate in ethylenediamine containing system was designed and optimized with galvanic current curves of Cu-Ag couple under different conditions using an advanced electrochemical station. The results show that optimal technical parameters for I-Ag can be obtained rapidly and directly, according to the shape ( appears wall-like deposition current or not) and the remainder current value on the curve of galvanic current with time. Based on the galvanic current method, a smooth and dense silver coating on copper foil can be prepared ( the silver ion concentration is 3g/L,molar ratio of silver ion and en is l: 5 , the pH value is 11. 3) . |
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