| XIAO Jin,ZHAI Qian,ZHOU Yan-qiong,LI Wu-chu,CHEN Ji-song,WANG Chao-chao.Ultrasonic Assisted Transient Solid Phase Bonding Technology Based on Copper-indium Micro Nano Layer at Room Temperature[J],51(12):312-319 |
| Ultrasonic Assisted Transient Solid Phase Bonding Technology Based on Copper-indium Micro Nano Layer at Room Temperature |
| |
| View Full Text View/Add Comment Download reader |
| DOI：10.16490/j.cnki.issn.1001-3660.2022.12.032 |
| KeyWord:metal material solid phase bonding Cu-In micro nano bonding strength diffusion |
| Author | Institution |
| XIAO Jin |
Guangzhou Huali College, Guangzhou , China |
| ZHAI Qian |
Guangzhou Huali College, Guangzhou , China |
| ZHOU Yan-qiong |
Guangzhou Huali College, Guangzhou , China |
| LI Wu-chu |
Guangzhou Huali College, Guangzhou , China |
| CHEN Ji-song |
Guangzhou Huali College, Guangzhou , China |
| WANG Chao-chao |
Guangzhou Huali College, Guangzhou , China |
|
| Hits: |
| Download times: |
| Abstract: |
| High density three-dimensional lamination technology is the development trend of electronic packaging technology. With the thickness and spacing of chips becoming smaller and smaller, in order to solve the problem of high thermal stress caused by high temperature and aggravating signal delay in traditional reflow soldering process, the work aims to adopt the needle shaped copper-indium micro nano layer and ultrasonic assistance to realize bonding and interconnection at room temperature to ensure the reliability of interconnection. Ultrasonic assisted bonding technology refers to the bonding of metals on both sides under the action of ultrasonic and pressure, which can realize the low-temperature bonding between chips in a very short bonding time. The bonding pressure is small. Compared with the traditional hot pressing bonding, it reduces the damage of hot pressing to the chip and improves the reliability of the package. |
| Close |
|
|
|