ZHANG Li,ZHANG Yan.Research Progress and Development Trend of Chemical Plating[J],46(12):104-109 |
Research Progress and Development Trend of Chemical Plating |
Received:July 01, 2017 Revised:December 20, 2017 |
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DOI:10.16490/j.cnki.issn.1001-3660.2017.12.018 |
KeyWord:chemical plating nickel plating copper plating cobalt plating silver plating tin plating gold plating |
Author | Institution |
ZHANG Li |
Department of Applied Chemistry, Hengshui University, Hengshui , China |
ZHANG Yan |
Department of Applied Chemistry, Hengshui University, Hengshui , China |
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Abstract: |
Chemical plating can enhance surface properties of substrate materials effectively and expand its application range of substrate materials, hence it has extensive application prospect in many fields. Basic principle, handling method and application technology of chemical plating were reviewed. Research progress of electroless plating were discussed in detail, and types and application technologies of chemical plating were summarized, mainly including chemical nickel plating, chemical copper plating, chemical cobalt plating, chemical silver plating, chemical tin plating and chemical gold plating. Moreover, research progress, advantages, disadvantages and application scope of various chemical plating were discussed. Problems of chemical plating were concluded. The main concerns—energy consumption and environmental pollution have attracted much public concern. Chemical plating technology showed diversification trend of development, mainly in laser-enhanced chemical plating, ultrasonic chemical plating, powder chemical plating, multi-layer chemical plating, rare earth chemical plating and composite electroless plating. One development direction of chemical plating in the future is to further improve original chemical plating process, the other is new application of chemical plating technology brought by new field of commercial value and super functional new materials. |
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