黎德育,夏国锋,郑振,王紫玉,田栋,王晨,翟文杰,李宁.铜在磷酸溶液中的电化学抛光研究[J].表面技术,2013,42(3):1-4,37.
LI De-yu,XIA Guo-feng,ZHENG Zhen,WANG Zi-yu,TIAN Dong,WANG Chen,ZHAI Wen-jie,LI Ning.Research on the Copper Electrochemical Polishing in Phosphoric Acid[J].Surface Technology,2013,42(3):1-4,37 |
| 铜在磷酸溶液中的电化学抛光研究 |
| Research on the Copper Electrochemical Polishing in Phosphoric Acid |
| 投稿时间：2012-12-12 修订日期：2013-01-26 |
| DOI： |
| 中文关键词: 铜 磷酸 电化学抛光 粗糙度 电化学阻抗谱 |
| 英文关键词:copper phosphoric acid electrochemical polishing roughness electrochemical impedance spectroscopy |
| 基金项目:国家自然科学基金资助项目(50975058) |
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| Author | Institution |
| LI De-yu | Harbin Institute of Technology, Harbin 150001 , China |
| XIA Guo-feng | Harbin Institute of Technology, Harbin 150001 , China |
| ZHENG Zhen | Harbin Institute of Technology, Harbin 150001 , China |
| WANG Zi-yu | Harbin Institute of Technology, Harbin 150001 , China |
| TIAN Dong | Harbin Institute of Technology, Harbin 150001 , China |
| WANG Chen | Harbin Institute of Technology, Harbin 150001 , China |
| ZHAI Wen-jie | Harbin Institute of Technology, Harbin 150001 , China |
| LI Ning | Harbin Institute of Technology, Harbin 150001 , China |
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| 中文摘要: |
| 通过阳极极化和电化学阻抗谱测试,研究了铜在磷酸溶液中进行电化学抛光的电化学行为。 研究发现:随着磷酸浓度的增加,铜在 0 . 2 ,0 . 4 ,0 . 6 ,0 . 8 V 四个电位下电化学抛光后的粗糙度都呈现先减小、后增大的趋势,在磷酸质量分数为 55% 时达最低值;EIS 图谱拟合的 Rs 值的变化反映了磷酸盐粘膜层电阻和铜表面氧化膜电阻的变化,此外,随着磷酸浓度的增加,EIS 中第一个容抗半圆的弛豫时间延长,铜的溶解反应速度加快。 |
| 英文摘要: |
| The eletrochemical properties of Cu eletrochemical polishing in phophoric acid solutions has been studied by anodic polarization and electrochemical impedance spectroscopy ( EIS) technique. The roughness of Cu firstly decreased, and then increased with the concentration of H3PO4increased at 0 . 2 V, 0 . 4 V, 0 . 6 V and 0 . 8 V, and reached the minimum roughness value when the H3PO4concentration was 55 % . The Rs value at different potential, fitting results of EIS, suggested the change in the resistance of viscous phosphate and Cu oxide films. With the increase of phosphate concentration, the relaxation time of the first capacitive semicircle extended, and it mean the acceleration in the copper dissolution reaction. |
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