汤家港,葛大丽.基于数值模拟的电镀3D打印厚度均匀性研究[J].表面技术,2023,52(3):318-326.
TANG Jia-gang,GE Da-li.Thickness Uniformity of Electroplating 3D Printing Based on Numerical Simulation[J].Surface Technology,2023,52(3):318-326
基于数值模拟的电镀3D打印厚度均匀性研究
Thickness Uniformity of Electroplating 3D Printing Based on Numerical Simulation
  
DOI:10.16490/j.cnki.issn.1001-3660.2023.03.029
中文关键词:  增材制造  电镀3D打印  厚度均匀性  电极反应动力学  物质传递  多物理场模型
英文关键词:additive manufacturing  electroplating 3D printing  thickness uniformity  kinetics of electrode reaction  material transfer  multi-physical field model
基金项目:安徽省重点研究与开发计划项目(1804a09020001)
作者单位
汤家港 中国科学技术大学 近代力学系 先进技术研究院 安徽春谷增材制造联合实验室,合肥 230088 
葛大丽 中国科学技术大学 近代力学系 先进技术研究院 安徽春谷增材制造联合实验室,合肥 230088;安徽建筑大学 土木工程学院,合肥 230601 
AuthorInstitution
TANG Jia-gang Department of Modern Mechanics,IAT-Chungu Joint Laboratory for Additive Manufacturing, University of Science and Technology of China, Hefei 230088, China 
GE Da-li Department of Modern Mechanics,IAT-Chungu Joint Laboratory for Additive Manufacturing, University of Science and Technology of China, Hefei 230088, China;School of Architecture and Construction, Anhui Jianzhu University, Hefei 230601, China 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 优化电镀3D打印工艺,提高单层电沉积厚度的均匀性。方法 建立耦合电解液流动、物质传递、电极反应的多物理场模型,并数值求解,研究反应离子浓度和电解液电势的分布云图,以及沉积层截面形貌随时间的演化规律,分析影响沉积层厚度均匀性的直接因素。最后讨论抑制剂本体浓度CS、对流流速u0、电解液电导率κ及阴极电位φc等因素对沉积层厚度均匀性的影响规律。结果 随着沉积时间的增长,沉积层的形貌越发不平整,反应离子浓度和电解液电势的分布云图随沉积层截面形貌的变化而变化。加入40 μmol/L抑制剂后,沉积层表面的反应离子浓度和过电势的分布更加均匀。抑制剂本体浓度越高,沉积层截面形貌越平整,沉积层厚度均匀性越好,但存在一个饱和抑制剂浓度40 μmol/L。沉积层厚度均匀性随对流流速或电解液电导率的增大先增后减,随阴极电位增大单调递增。结论 阴极表面反应离子浓度和过电势的不均匀分布是导致沉积层厚度不均匀性的直接因素。添加抑制剂可有效改善沉积层厚度的均匀性,过大或过小的流速或电导率都会降低沉积层的厚度均匀性,适当提高阴极电位可提高沉积层厚度均匀性。
英文摘要:
      Electroplating 3D printing is one of the most important electrodeposition-based additive manufacturing technologies. Compared with traditional manufacturing technology, it has some distinct advantages such as high dimensional accuracy and great process repeatability. However, the thickness non-uniformity of the electrodeposited coatings is a bottleneck problem for the further development of the technology. This problem seriously affects the accuracy, availability, and mechanical properties of the printed parts. The work aims to optimize the electroplating 3D printing process and improve the thickness uniformity of single-layer electrodeposition. The multi-physical field theory model coupling electrolyte flow, mass transfer, and electrode reaction was established and numerically solved. The evolution law of the distribution cloud diagram of reactive ion concentration and electrolyte potential as well as deposited layer morphology with time was studied. Combined with electrode reaction kinetics, the direct factors affecting the thickness uniformity of the deposited layer were analyzed. Finally, the effect of main factors on the thickness uniformity of the deposited layer was discussed, such as inhibitor concentration in bulk solution CS, fluid velocity in bulk solution u0, conductivity of the electrolyte κ, and cathode potential φc. The simulation results indicated that with the increase of deposition time, the morphology of the deposited layer became more and more uneven. The distribution cloud diagram of reactive ion concentration and electrolyte potential varied with the morphology of the deposited layer. The distribution uniformity of reactive ion concentration and overpotential on the surface of the deposited layer was improved after addition of 40 μmol/L inhibitor. Generally, as the inhibitor concentration in bulk solution increased, the morphology of the deposited layer became smoother and the thickness uniformity of the deposited layer became better. However, there was a saturated concentration of 40 μmol/L. When the saturation concentration exceeded the saturated concentration, the thickness uniformity of the deposited layer did not increase with the increase of the concentration of inhibitor. The morphology of the deposited layer was usually saddle-shaped. The thickness of the left side of the deposited layer was slightly higher than that of the right side at a low fluid velocity. As the fluid velocity increased, the morphology of the deposited layer gradually changed to a saddle shape with a lower left and a higher right. At low conductivity, the deposited layer exhibited a saddle-shaped morphology. With the increase of conductivity, the morphology of the deposited layer gradually changed to a hump-shaped morphology. The lower the cathode potential was, the more obvious the saddle shape features were. The thickness uniformity of the deposited layer firstly increased and then decreased with the increase of fluid velocity or electrolyte conductivity, and monotonically increased with the increase of cathode potential. The non-uniform distribution of reactive ion concentration and overpotential on the cathode surface directly leads to the non-uniformity of deposited layer thickness. At the same time, the changing morphology of the deposited layer can react on the distribution of reactive ion concentration and overpotential on the cathode surface. Adding enough inhibitors can effectively improve the thickness uniformity of the deposited layer. Too large or too small fluid velocity or conductivity will reduce the thickness uniformity of the deposited layer. The thickness uniformity of the deposited layer can be improved by appropriately increasing the cathode potential.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第19835828位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号