许宁徽,李薇薇,钱佳,孙运乾.基于稳定pH值的硅衬底晶圆抛光液成分优化[J].表面技术,2022,51(12):277-284, 319.
XU Ning-hui,LI Wei-wei,QIAN Jia,SUN Yun-qian.Component Optimization of Polishing Slurry for Silicon Substrate Wafer Based on Stable pH Value[J].Surface Technology,2022,51(12):277-284, 319 |
| 基于稳定pH值的硅衬底晶圆抛光液成分优化 |
| Component Optimization of Polishing Slurry for Silicon Substrate Wafer Based on Stable pH Value |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.12.028 |
| 中文关键词: 抛光液 二氧化硅水溶胶 有机碱 pH缓冲剂 pH稳定剂 抛光去除速率 抛光液寿命 表面粗糙度 |
| 英文关键词:polishing slurry silica hydrosol organic base pH buffer pH stabilizer polishing rate service life of polishing slurry surface roughness |
| 基金项目:光电信息控制和安全技术重点实验室基金(614210701041705) |
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| Author | Institution |
| XU Ning-hui | College of Electronic Information Engineering, Hebei University of Technology, Tianjin 300401, China |
| LI Wei-wei | College of Electronic Information Engineering, Hebei University of Technology, Tianjin 300401, China |
| QIAN Jia | College of Electronic Information Engineering, Hebei University of Technology, Tianjin 300401, China |
| SUN Yun-qian | College of Electronic Information Engineering, Hebei University of Technology, Tianjin 300401, China |
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| 中文摘要: |
| 目的 探究不同配比方案配制pH值相同的抛光液对抛光去除速率、抛光液寿命和表面粗糙度的影响，优化硅衬底晶圆抛光液，使其满足半导体产业的发展要求。方法 以二氧化硅水溶胶为磨料，通过设置有机碱、pH缓冲剂、pH稳定剂的不同配比来调节和稳定抛光液的初始pH值(11.0~12.0)，在最佳工艺参数下循环使用抛光液对2英寸(1英寸≈2.54 cm)硅衬底晶圆进行抛光实验。研究不同配比下抛光液pH值、抛光去除速率随抛光液循环使用时间的变化情况。对比实验结果，分析各种成分在抛光过程中的作用，以及对抛光效果产生的影响，得出最佳配比方案，优化抛光液方案。结果 通过优化硅衬底晶圆的抛光液方案，使抛光去除速率达到0.804 μm/min，抛光液的寿命延长了约114.29%，抛光后硅衬底晶圆的表面粗糙度最低为0.156 nm。结论 得到了抛光液的最佳配比方案，有机碱的质量分数为1.0%，pH缓冲剂的质量分数为1.1%，并加入pH稳定剂调节pH，使其抛光去除速率、抛光液寿命、表面粗糙度都得到很大提升。 |
| 英文摘要: |
| In order to solve the problem that the pH value of polishing slurry on silicon substrate wafer is slowly decreasing with the increase of service time and poor buffering ability, and that the domestic nano-silica hydrosol has a large gap with the international level, the work aims to explore the effects of different proportioning formulas on polishing rate, service life of polishing slurry and surface roughness under the same pH value and optimize the polishing slurry for silicon wafer to meet the development requirements of semiconductor industry. |
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