王有良,史小锋,陈秀娟,张文娟,冯铭.基于双磁场磁性复合流体的抛光性能[J].表面技术,2022,51(11):360-372.
WANG You-liang,SHI Xiao-feng,CHEN Xiu-juan,ZHANG Wen-juan,FENG Ming.Polishing Performance of Magnetic Compound Fluid Based on Double Magnetic Field[J].Surface Technology,2022,51(11):360-372 |
| 基于双磁场磁性复合流体的抛光性能 |
| Polishing Performance of Magnetic Compound Fluid Based on Double Magnetic Field |
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| DOI：10.16490/j.cnki.issn.1001-3660.2022.11.034 |
| 中文关键词: 磁性复合流体 双磁场 抛光性能 表面粗糙度 磁场分布 成形特征 |
| 英文关键词:magnetic compound fluid doublemagnetic field polishing performance surface roughness magnetic field distribution forming characteristic |
| 基金项目:甘肃省科技计划（21JR7RA783）；兰州理工大学红柳优青项目（07/062004）；浙江省自然科学基金（LQ22E050008） |
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| Author | Institution |
| WANG You-liang | Lanzhou University of Technology, Lanzhou 730050, China |
| SHI Xiao-feng | Lanzhou University of Technology, Lanzhou 730050, China |
| CHEN Xiu-juan | Lanzhou University of Technology, Lanzhou 730050, China |
| ZHANG Wen-juan | Lanzhou University of Technology, Lanzhou 730050, China |
| FENG Ming | Wenzhou University, Zhejiang Wenzhou 100083, China |
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| 中文摘要: |
| 目的 针对微结构抛光过程中形貌精度损伤的问题，开发一种环状MCF（Magnetic Compound Fluid，MCF）抛光工具，探究在双磁场作用下MCF工具的抛光性能。方法 采用工业相机观察不同条件下MCF抛光工具的成形特征，通过定量分析MCF抛光工具的成形参数，构建最优MCF抛光工具特征参数；通过分析双磁场作用下工件表面的磁场强度，建立磁场矢量模型，探究磁场分布与MCF宏观形貌的内在联系；观察磁簇微观形貌，分析MCF抛光工具的内部特征；试验研究MCF组分、磁铁转速nm、载液板转速nc和加工间隙Δ对工件表面粗糙度Ra的影响规律，探究最优的抛光参数。结果 当磁铁偏心距r=2 mm，MCF供应量V=1.5 mL时，MCF抛光工具的成形特征相对最优，得到了MCF抛光工具的参数，a=28.70 mm，b=26.90 mm，c1=1.58 mm，c2=1.30 mm，d0=48.60 mm，h=7.20 mm，di= 26.50 mm；磁簇分布方向与磁场矢量方向一致，铁粉沿着磁力线方向分布，磨粒分布在铁粉外部，α–纤维穿插于磁簇内部或磁簇与磁簇之间；通过抛光试验获得了较低表面粗糙度的最佳工艺参数，最佳MCF组分配比（均以质量分数计）为羰基铁粉40%、磨粒12%、α–纤维3%、水基磁流体45%，最佳载液板转速nc=300 r/min，最佳磁铁转速nm=400 r/min，最佳加工间隙Δ=1 mm。结论 在抛光20 min后，工件的表面粗糙度由0.578 μm降至0.009 μm，下降率约为98.44%，证明在双磁场作用下环状MCF抛光工具具有稳定且高效的抛光能力。 |
| 英文摘要: |
| Magnetic field assisted magnetic compound fluid (MCF) polishing method is a novel ultra-precision surface machining technology. The work aims to develop an annular MCF (Magnetic Compound Fluid) polishing tool under the external doublemagnetic field to avoidthe damage of morphology accuracy of microstructure caused by traditional MCF polishing tool in the polishing process and explorethe basic performances of the proposed annular MCF polishing tool under the given experimental conditions.In addition, the effectsof processing parameters on the surface roughness of workpiece were studied in detail.The forming characteristics of MCF polishing tool under different given conditions were observed by industrial cameras. The characteristic parameters of the optimal MCF polishing tool were constructed by analyzing the forming parameters of MCF polishing tools quantitatively. When the magnet eccentricity r=2 mm and the MCF supply V=1.5 mL, the forming characteristics of MCF polishing tool were the best. The parameters of MCF tool were a=28.70 mm, b=26.90 mm, c1=1.58 mm, c2=1.30 mm, d0=48.60 mm, h=7.20 mm and di=26.50 mm. Afterwards, by analyzing the magnetic field intensity on the workpiece surface under the action of double magnetic field, a magnetic field vector model wasestablished. After drying the MCF polishing tool, the internal relationship between the magnetic field distribution and the macro morphology of the MCF polishing tool wasexplored. At the same time, the micro morphology of the magnetic cluster wasobserved with a metallographic microscope, and the internal characteristics of the MCF polishing tool wereanalyzed. The distribution direction of the magnetic cluster wasconsistent with the direction of the magnetic field vector. The iron powder wasdistributed along the direction of the magnetic force line, and the abrasive particles weredistributed outside the iron powder, α- Fibers wereinterspersed inside or between magnetic clusters, which also verifiedthe principle of MCF polishing. Finally, the polishing experiment was carried out with PC board, and the MCF components, the effectsof MCF components, revolution speed of the magnet nm, revolution speed of the MCF carrier nc and working gap Δ on the workpiece surface roughness were investigated to explore the optimal polishing parameters. The optimalprocess parameters with low surface roughness were obtained through polishing experiments. The best process parameters included the optimal MCF group distribution ratio of 40wt.% carbon iron powder, 12wt.% abrasive particle, 3wt.% α-cellulose and 45wt.% magnetic fluid (MF), the optimal revolution speed of the MCF carrier nc=300 r/min, the optimal revolution speed of the magnet nm=400 r/min, and the optimal work gap Δ=1 mm.Under the optimum process parameters, the surface roughness of workpiece after 20 min polishing decreases from 0.578 μm to 0.009 μm, which indicates the polished workpiece surface is smoother than that before polishing. In addition, the reduction rate of surface roughness Ra is as high as 98.44%, which proves that the annular MCF polishing tool has stable and efficient polishing ability under the action of doublemagnetic field. |
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