戴槟,李晓舟,许金凯,王晶东,陈广俊,王茂旬,王深.振幅对超声辅助磨削C/SiC复合材料表面形貌的影响[J].表面技术,2022,51(7):263-273.
DAI Bin,LI Xiao-zhou,XU Jin-kai,WANG Jing-dong,CHEN Guang-jun,WANG Mao-xun,WANG Shen.Amplitude Effect on Surface Morphology by Ultrasonic-assisted Grinding of C/SiC Composite[J].Surface Technology,2022,51(7):263-273
振幅对超声辅助磨削C/SiC复合材料表面形貌的影响
Amplitude Effect on Surface Morphology by Ultrasonic-assisted Grinding of C/SiC Composite
  
DOI:10.16490/j.cnki.issn.1001-3660.2022.07.026
中文关键词:  C/SiC复合材料  超声辅助加工  表面质量  表面粗糙度
英文关键词:C/SiC composite  ultrasonic-assisted machining  surface quality  surface roughness
基金项目:国家自然科学基金(U19A20103);装备预研项目(61409230115);“111”引智基地(D17017)
作者单位
戴槟 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
李晓舟 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
许金凯 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
王晶东 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
陈广俊 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
王茂旬 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
王深 长春理工大学 跨尺度微纳制造教育部重点实验室,长春 130012 
AuthorInstitution
DAI Bin Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
LI Xiao-zhou Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
XU Jin-kai Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
WANG Jing-dong Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
CHEN Guang-jun Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
WANG Mao-xun Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
WANG Shen Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130012, China 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 通过超声振动辅助磨削加工技术加工C/SiC复合材料可以改变材料的去除方式,通过改变超声振幅能够提高材料去除率并获得较好的表面质量,从而成为C/SiC复合材料的新型加工方式。方法 采用超声辅助磨削技术对C/SiC复合材料进行加工,通过改变超声振幅,观察C/SiC复合材料在不同切削角度下的纤维去除机理、纤维断裂形式,测量不同切削角度下工件表面粗糙度Sa。结果 磨削过程中C/SiC复合材料的去除方式以脆性去除为主,纤维损伤形式以纤维断裂、纤维破碎为主。增大超声振幅后,纤维断裂形式增大并伴随出现基体破碎现象。随着超声振幅的增大,不同切削角度(0°、45°、90°、135°)下测得的表面粗糙度Sa显著减小,降低约15%~41%。结论 由于超声振动的作用,C/SiC复合材料在不同切削角度(0°、45°、90°、135°)下的材料去除方式发生改变,相比于常规磨削的纤维断裂形式,施加超声振动后,磨削过程中产生的纤维折断和基体破碎被去除,在提高材料去除率的同时,表面质量明显提高。随着超声振幅的增大,不同切削角度(0°、45°、90°、135°)下的表面粗糙度Sa都减小,且减小程度也不同,减小程度由大到小的顺序为45°>135°>90° >0°。
英文摘要:
      The machining of C/SiC composite is one of the most challenging problems in mechanical machining. Conventional machining methods for machining C/SiC composites may lead to difficulty to remove the chips, the surface of poor quality characteristics, machining accuracy is difficult to guarantee. By ultrasonic vibration assisted grinding machining technology C/SiC composite material removal mode may be varied by adjusting the ultrasonic amplitude, material removal rate can be increased, a better surface quality can be obtained, thus becoming the new processing C/SiC Composites the way.In this paper, ultrasonic-assisted grinding technology is used to grind C/SiC composite. By adjusting the ultrasonic amplitude, the mode of material removal and the fiber damage, and the surface roughness Sa of the workpiece are measured at different cutting angles. The result shows:In the machining process, the C/SiC composite is removed mainly by brittleness, and the fiber is damaged in the mode of fiber fracture and fiber fragmentation. As the ultrasonic amplitude is increased, the material removal rate is significantly increased, and the surface quality is improved,and the surface roughness Sa measured at different cutting angles (0°, 45°, 90°, 135°) is significantly reduced, about 15% to 41%. Due to the effect of ultrasonic vibration, the material removal method of different fiber angles (0°, 45°, 90°, 135°) of C/SiC composite material has changed. Due to the effect of ultrasonic vibration, in the machining process, the fiber breakage and matrix fragmentation are removed. While the material removal rate is increased, the surface quality is significantly improved. With the increase of the ultrasonic amplitude, the surface roughness Sa of different fiber cutting angles (0°, 45°, 90°, 135°) is correspondingly reduced, and the degree of reduction of the different fiber cutting angle Sa is also different, specifically:45°>135°>90°>0°.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第20071566位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号