战贵盼,韩永恒,谭晓明,丛凯,赵仁杰.模拟海洋大气环境下PCB-HASL的腐蚀行为与机理[J].表面技术,2022,51(5):245-253, 303.
ZHAN Gui-pan,HAN Yong-heng,TAN Xiao-ming,CONG Kai,ZHAO Ren-jie.Corrosion Behavior and Mechanism of PCB-HASL in Simulated Marine Atmospheric Environment[J].Surface Technology,2022,51(5):245-253, 303
模拟海洋大气环境下PCB-HASL的腐蚀行为与机理
Corrosion Behavior and Mechanism of PCB-HASL in Simulated Marine Atmospheric Environment
  
DOI:10.16490/j.cnki.issn.1001-3660.2022.05.025
中文关键词:  海洋环境  PCB-HASL  微区电化学  扫描Kelvin探针技术  电化学阻抗谱  腐蚀行为和机理
英文关键词:marine environment  PCB-HASL  micro area electrochemistry  scanning Kelvin probe technique  electrochemical impedance spectroscopy  corrosion behavior and mechanism
基金项目:
作者单位
战贵盼 海装驻北京地区军事代表局,北京 100074 
韩永恒 海装驻北京地区军事代表局,北京 100074 
谭晓明 海军航空大学青岛校区,山东 青岛 266041 
丛凯 海装驻北京地区军事代表局,北京 100074 
赵仁杰 海装驻北京地区军事代表局,北京 100074 
AuthorInstitution
ZHAN Gui-pan Military Representative Office of the Ministry of Naval Equipment in Beijing, Beijing 100074, China 
HAN Yong-heng Military Representative Office of the Ministry of Naval Equipment in Beijing, Beijing 100074, China 
TAN Xiao-ming Qingdao Branch of Naval Aeronautical University, Shandong Qingdao 266041, China 
CONG Kai Military Representative Office of the Ministry of Naval Equipment in Beijing, Beijing 100074, China 
ZHAO Ren-jie Military Representative Office of the Ministry of Naval Equipment in Beijing, Beijing 100074, China 
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中文摘要:
      目的 基于舰载机服役海洋环境,针对热风整平无铅喷锡印制电路板(Hot Air Solder Level Printed Circuit Board,PCB-HASL)开展加速腐蚀试验研究,揭示其腐蚀机理,表征其宏/微观腐蚀电化学行为。方法 根据实测的服役海洋大气环境数据,基于编制的加速腐蚀试验环境谱,针对PCB-HASL开展了加速腐蚀试验。采用电化学工作站测试不同腐蚀周期试样的极化曲线和电化学阻抗谱,表征了腐蚀电化学机理和宏观电化学特性。采用扫描Kelvin探针技术测试了不同腐蚀周期试样表面Kelvin电位分布特征,表征了微区电化学特性。结果 腐蚀第6周期时,PCB-HASL的绝缘电阻大幅度衰减,达到失效临界状态;第0~2周期,自腐蚀电流密度由1.43 μA/cm2陡增至3.97 μA/cm2,腐蚀速率快速增大,局部区域诱发腐蚀;第2~3周期,自腐蚀电流密度降低,腐蚀速率降低;第3~4周期,自腐蚀电流密度稍有增大,腐蚀速率稍微增加,腐蚀产物局部发生脱落;第4~7周期,自腐蚀电流密度减小,在第7周期达到最小,为0.55 μA/cm2,相比第2周期降低了86%,呈明显的均匀腐蚀特征。Kelvin电位分布和电荷转移电阻的倒数(1/Rct)随加速腐蚀试验周期的变化规律与自腐蚀电流密度的变化规律相吻合。结论 PCB-HASL的腐蚀速率随加速试验周期大致呈增大—减小—小幅增大—减小的变化规律,由初期的局部区域腐蚀逐渐转变为后期的均匀腐蚀,在表面形成较为致密的腐蚀产物层,使得腐蚀速率大大降低。
英文摘要:
      Based on the marine environment of Shipborne aircraft in service, the accelerated corrosion test was carried out for hot air leveling lead-free tin sprayed printed circuit board (PCB-HASL), which revealed the corrosion mechanism and characterized the macro/micro corrosion electrochemical behavior. According to the measured marine atmospheric environment data, based on the prepared accelerated corrosion test environment spectrum, the accelerated corrosion test was carried out for PCB-HASL. The polarization curve and electrochemical impedance spectroscopy of samples with different corrosion cycles were measured by electrochemical workstation, and the corrosion electrochemical mechanism and macro electrochemical characteristics were characterized; Scanning Kelvin probe technique was used to measure the distribution characteristics of Kelvin potential on the surface of samples with different corrosion cycles, and the micro area electrochemistry characteristics were characterized. During the 6th cycle of corrosion, the insulation resistance of PCB-HASL decreases greatly and reaches the critical state of failure; In cycle 0th-2nd, the self corrosion current density increased from 1.43 μA/cm2 increased sharply to 3.97 μA/cm2, the corrosion rate increases rapidly and corrosion is induced in local areas; In the 2nd-3rd cycle, the self corrosion current density decreases and the corrosion rate decreases; In the 3rd-4th cycle, the self corrosion current density increased slightly, the corrosion rate increased slightly, and the corrosion products fell off locally; In the 4th-7th cycle, the self corrosion current density decreases and reaches the minimum in the 7th cycle, which is 0.55 μA/cm2, decreased by 86% compared with the second cycle, showing obvious uniform corrosion characteristics. The variation law of Kelvin potential distribution and reciprocal of charge transfer resistance (1/Rct) with the accelerated corrosion test cycle is consistent with the variation law of self corrosion current density. The corrosion rate of PCB-HASL roughly increases-decreases-slightly increases-decreases with the accelerated test cycle, and gradually changes from local corrosion in the initial stage to uniform corrosion in the later stage. A relatively dense corrosion product layer is formed on the surface, which greatly reduces the corrosion rate.
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