谭晓明,战贵盼,张丹峰,彭志刚,王德.加速腐蚀试验下PCB-ENIG的腐蚀电化学行为[J].表面技术,2021,50(10):345-352.
TAN Xiao-ming,ZHAN Gui-pan,ZHANG Dan-feng,PENG Zhi-gang,WANG De.Corrosion Electrochemical Behaviour of PCB-ENIG in Accelerated Test Environment[J].Surface Technology,2021,50(10):345-352
加速腐蚀试验下PCB-ENIG的腐蚀电化学行为
Corrosion Electrochemical Behaviour of PCB-ENIG in Accelerated Test Environment
投稿时间:2020-10-15  修订日期:2021-03-16
DOI:10.16490/j.cnki.issn.1001-3660.2021.10.036
中文关键词:  化学镀镍金印制电路板  电化学阻抗谱  微区电化学  扫描Kelvin探针技术  腐蚀电化学行为
英文关键词:PCB-ENIG  electrochemical impedance resonance  micro area electrochemistry  scanning Kelvin probe technology  corrosion electrochemical behavior
基金项目:
作者单位
谭晓明 海军航空大学青岛校区,山东 青岛 266041 
战贵盼 海装驻北京地区第三军事代表室,北京 100074 
张丹峰 海军航空大学青岛校区,山东 青岛 266041 
彭志刚 海军航空大学青岛校区,山东 青岛 266041 
王德 海军航空大学青岛校区,山东 青岛 266041 
AuthorInstitution
TAN Xiao-ming Qingdao Branch of Naval Aeronautical University, Qingdao 266041, China 
ZHAN Gui-pan The Third Military Representative Office of the Department of Naval Equipment in Beijing, Beijing 100074, China 
ZHANG Dan-feng Qingdao Branch of Naval Aeronautical University, Qingdao 266041, China 
PENG Zhi-gang Qingdao Branch of Naval Aeronautical University, Qingdao 266041, China 
WANG De Qingdao Branch of Naval Aeronautical University, Qingdao 266041, China 
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中文摘要:
      目的 针对化学镀镍金印制电路板(PCB-ENIG, Electroless Nickel Immersion Gold Printed Circuit Board)模拟舰载机服役的海洋大气环境,研究其腐蚀电化学行为。方法 基于实测的环境数据,编制适用于电子设备的加速腐蚀试验环境谱,在实验室条件下开展加速腐蚀试验研究。采用电化学工作站定期测试分析试样的电化学阻抗谱,以电荷转移电阻Rct的倒数(1/Rct)为腐蚀速率表征参数,分析其宏观电化学行为。采用扫描Kelvin探针技术(SKP)定期测试试样表面伏打电位分布特征,以电位均值μ和标准差s等参数表征微区电化学特性。结果 第0~1周期,电荷转移电阻Rct由217.43 kΩ.cm2增至283.41 kΩ.cm2,腐蚀速率小幅度降低,主要发生微孔腐蚀。第1~4周期,随着腐蚀周期的延长,微孔表面附着的腐蚀产物出现龟裂、剥落等现象,对腐蚀介质的阻挡作用减弱,阻抗弧半径不断减小,腐蚀速率不断增大;第4周期,Rct达到最小,仅为44.62 kΩ.cm2,腐蚀速率达到最大,表面伏打电位均值μ降至−381.37 mV,s增至55.52,呈现明显的阴阳极,腐蚀倾向较大。第5~7周期,腐蚀加重,表面腐蚀产物不断积聚,形成一层较厚的腐蚀产物层,腐蚀速率不断减小;第7周期,电荷转移电阻达到最大,为311.31 kΩ.cm2,表面电位均值升至−256.45 mV,电位标准差较大,电位分布较为分散,说明腐蚀产物的积聚会降低腐蚀速率。结论 不同腐蚀周期,PCB-ENIG试样表面微区Kelvin电位服从正态分布;随着加速腐蚀时间的增长,PCB-ENIG腐蚀速率呈减小-增大-减小的变化规律。
英文摘要:
      To studythe corrosion electrochemical behavior of electroless nickel gold printed circuit board (PCB-ENIG) in marine atmospheric environment of shipboard aircraft. Based on the measured environmental data, the accelerated corrosion test environmental spectrum suitable for electronic equipment was compiled, and the accelerated corrosion test research was carried out under laboratory conditions. And the electrochemical workstation was used to test and analyze the electrochemical impedance spectroscopy of the samples. The electrochemical behavior of PCB-ENIG was analyzed by using the reciprocal of charge transfer resistance 1/Rct as the characterization parameter of corrosion rate. The voltage potential distribution on the surface of PCB-ENIG was measured by Scanning Kelvin Probe technology (SKP), and the micro electrochemical characteristics of PCB-ENIG were characterized by potential mean μ and standard deviation s. The charge transfer resistance Rct was from 217.43 kΩ.cm2 to 283.41 kΩ.cm2 in the 0th~1st cycle, and the corrosion rate decreased slightly. At this time, the micro hole corrosion mainly occurred. With the extension of the corrosion cycle, the corrosion products attached to the surface of the micro pores appeared cracking and spalling, and the blocking effect on the corrosion medium was weakened. In the 1st~4th cycle, the radius of the impedance arc decreased and the corrosion rate increased. In the 4th cycle, Rct reached the minimum, which was only 44.62 kΩ.cm2, the corrosion rate reached the maximum, and the average surface potential μ decreased to −381.37 mV and s increased to 55.52. The results showed that there were obvious anode and cathode, and the corrosion tendency was large. In the 5th~7th cycle, the corrosion was aggravated, and the surface corrosion products accumulated and increased continuously, forming a thick corrosion product layer, and the corrosion rate decreased continuously. In the 7th cycle, the charge transfer resistance reached the maximum, which was 311.31 kΩ.cm2. At this time, the average surface potential increased to −256.45 mV, the potential standard deviation was large and the potential distribution was relatively scattered, which indicated that the accumulation of corrosion products would reduce the corrosion rate. The Kelvin potential of micro area on PCB-ENIG surface obeys normal distribution in different corrosion cycles. With the increase of accelerated corrosion time, the corrosion rate of PCB-ENIG decreases, increases and decreases.
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