谭小生,王春霞,曹鑫帅,张玉清.脂肪醇聚氧乙烯醚硫酸钠对电沉积铜薄膜性能的影响[J].表面技术,2021,50(8):366-374, 403.
TAN Xiao-sheng,WANG Chun-xia,CAO Xin-shuai,ZHANG Yu-qing.Effect of AES Surfactant on the Performance of Ethylenediamine Copper Plating[J].Surface Technology,2021,50(8):366-374, 403
脂肪醇聚氧乙烯醚硫酸钠对电沉积铜薄膜性能的影响
Effect of AES Surfactant on the Performance of Ethylenediamine Copper Plating
投稿时间:2020-10-19  修订日期:2020-12-25
DOI:10.16490/j.cnki.issn.1001-3660.2021.08.036
中文关键词:  乙二胺  镀铜  AES  表面活性剂  致密性  微观形貌  形核  粗糙度
英文关键词:ethylenediamine  copper plating  AES  surfactant  compactness  micro-morphology  nucleation  roughness
基金项目:
作者单位
谭小生 南昌航空大学 材料科学与工程学院,南昌 330063 
王春霞 南昌航空大学 材料科学与工程学院,南昌 330063 
曹鑫帅 南昌航空大学 材料科学与工程学院,南昌 330063 
张玉清 南昌航空大学 材料科学与工程学院,南昌 330063 
AuthorInstitution
TAN Xiao-sheng School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
WANG Chun-xia School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
CAO Xin-shuai School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
ZHANG Yu-qing School of Material Science and Engineering, Nanchang Hangkong University, Nanchang 330063, China 
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中文摘要:
      目的 研究脂肪醇聚氧乙烯醚硫酸钠(AES)在乙二胺无氰镀铜中的应用效果,分析对比AES对铜离子沉积、生长及镀层性能的影响。方法 利用电化学工作站,分析阴极电沉积过程,结合多功能腐蚀测量仪,得到渗氢曲线和Nyquist曲线,比较不同条件下镀层的致密性及耐蚀性,通过SEM、金相显微镜,观察镀层表面与截面的微观形貌,采用XRD分析镀层晶粒取向、尺寸及镀层内应力。结果 乙二胺镀铜电沉积过程为三维瞬时成核过程,受扩散步骤控制,镀层晶体择优取向为(111)面。在不含AES时,获取的镀层表面粗糙,晶粒杂乱,呈棱刺或颗粒状,内应力较大;在镀液中引入AES后,扩散系数增大,微分电容增大,阴极极化增强,成核电位负移,获取的镀层表面变得光滑、细致,镀层(220)晶面占比由28.95%减少到20.61%,粗糙度由2.784 μm下降为1.814 μm。渗氢曲线与EIS测试表明,镀液引入AES后,获取的镀层对氢渗透的阻挡能力增强,致密性改善,镀层耐蚀性明显提高。结论 AES表面活性剂在乙二胺镀铜体系中,对改善镀层微观结构、减少毛刺、提高镀层的致密性和耐蚀性具有显著效果,可有效提高乙二胺镀铜层的综合性能。
英文摘要:
      This work aims to study the application effect of Fatty Alcohol Polyoxyethylene Ether Sodium Sulfate (AES) in ethylenediamine cyanide-free copper plating, analyze and compare the effect of AES on copper ion deposition, growth and coating performance. In this work, electrochemical workstation was used to analyze the cathodic electrodeposition process, combined with the multifunctional corrosion measuring instrument to obtain the hydrogen permeation curve and the Nyquist curve, then the compactness and corrosion resistance of the coating under different conditions were compared. The microscopic morphology of the surface and cross section of the coating was observed by SEM and metallographic microscope, and XRD was used to analyze the grain orientation, grain size and internal stress of the coating. The result shows that the ethylenediamine copper plating electrodeposition process followed three-dimensional instantaneous nucleation process and was controlled by the diffusion step, and the preferred orientation of the coating crystal was (111) plane, and the surface of the coating obtained without AES introduced were rough, the crystal grains were disordered, and the grains were thorny or granular, with larger internal stress. After AES was introduced into the plating solution, the diffusion coefficient increased, the differential capacitance increased, the cathodic polarization increased, the nucleation potential shifted negatively, and the coating surface were smooth and fine. The proportion of (220) crystal planes reduced from 28.95% to 20.61%, and the roughness reduced from 2.784 μm to 1.814 μm. In addition, the hydrogen permeation curve and EIS test show that after AES was introduced into the plating solution, the ability to block hydrogen penetration of coating was strengthened, the compactness was improved, and the corrosion resistance of coating was also obviously improved. In summary, the introduction of AES surfactant in the ethylenediamine copper plating system has significant effects on improving the microstructure of the coating, reducing burrs, improving the compactness and corrosion resistance of the coating, and can effectively improve the overall performance of the copper coating.
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