蔡磊,马泽贤,刘新宽,盛荣生,雷雪松,方峰.电镀工艺对氨基磺酸盐体系镍镀层内应力的影响[J].表面技术,2021,50(2):347-354.
CAI Lei,MA Ze-xian,LIU Xin-kuan,SHENG Rong-sheng,LEI Xue-song,FANG Feng.Influence of Electroplating Process on Internal Stress of Nickel Coating in Sulfamate System[J].Surface Technology,2021,50(2):347-354
电镀工艺对氨基磺酸盐体系镍镀层内应力的影响
Influence of Electroplating Process on Internal Stress of Nickel Coating in Sulfamate System
投稿时间:2020-08-12  修订日期:2021-01-07
DOI:10.16490/j.cnki.issn.1001-3660.2021.02.037
中文关键词:  镀镍  双阳极-阴极弯曲  内应力  氨基磺酸镍  磁场  超声波
英文关键词:nickel plating, double anode-cathode bending, internal stress, nickel sulfamate, magnetic field, ultrasonic
基金项目:
作者单位
蔡磊 盛利维尔中国新材料技术有限公司,江苏 常州 213200 
马泽贤 上海理工大学 材料科学与工程学院,上海 200093 
刘新宽 上海理工大学 材料科学与工程学院,上海 200093 
盛荣生 盛利维尔中国新材料技术有限公司,江苏 常州 213200 
雷雪松 盛利维尔中国新材料技术有限公司,江苏 常州 213200 
方峰 东南大学 材料科学与工程学院,南京 211189 
AuthorInstitution
CAI Lei Sunnywell China New Material Technology Co., Ltd, Changzhou 213200, China 
MA Ze-xian School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China 
LIU Xin-kuan School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China 
SHENG Rong-sheng Sunnywell China New Material Technology Co., Ltd, Changzhou 213200, China 
LEI Xue-song Sunnywell China New Material Technology Co., Ltd, Changzhou 213200, China 
FANG Feng School of Science and Technology, Southeast University, Nanjing 211189, China 
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中文摘要:
      目的 在氨基磺酸盐电镀体系中,探索出各电镀工艺参数对镀层内应力的影响规律。方法 采用一种改良的双阳极-阴极弯曲的办法测试镀层应力。通过X射线衍射实验(XRD)、扫描电子显微镜(SEM)以及KEYENCE数码显微系统,分别分析应力状态下镀层织构、微观畸变以及镀层形貌。结果 电流密度越大,镀层的张应力越大,当电流密度达到15 A/dm2时,继续增加电流密度,镀层张应力值不变。电镀时间越长,镀层越厚,张应力值越大,电镀15 min后,镀层应力保持不变。Cl浓度越高,镀层的张应力值越大。电流密度对张应力的影响程度比电镀时间显著。X射线衍射全谱拟合表明,磁场的加入会抑制Ni(111)织构的形成,对Ni(200)有择优取向,同时使晶粒的微观畸变变小,磁场强度越强,应力越小。超声空化作用对镀层织构影响不明显,但会降低晶粒的微观畸变,并减小镀层张应力。结论 在氨基磺酸镍体系中,电流密度、电镀时间以及Cl浓度的增大都会显著增大张应力。磁场和超声的加入在细化晶粒的同时,减小了镀层张应力。
英文摘要:
      In order to explore the influence of various electroplating process parameters on the internal stress of the coating in the sulfamate electroplating system, a modified double anode-cathode bending method is used to test the coating stress. X-ray diffraction experiment (XRD), scanning electron microscope (SEM) and KEYENCE digital microscope system were used to analyze the coating texture, micro distortion and coating morphology under stress. The results show that the greater the current density, the greater the tensile stress of the coating. When the current density reaches 15 A/dm2, the tensile stress value of the coating remains unchanged with the increase the current density. The longer the electroplating time, the thicker the coating and the greater the tensile stress value. After 15 minutes of electroplating, the coating stress remains unchanged. The higher the Cl‒ is, The larger the tensile stress of the coating is. The influence of current density on tensile stress is more significant than the length of plating time. Full spectrum fitting of X-ray diffraction shows that the addition of a magnetic field will inhibit the formation of Ni(111) texture, have a preferential orientation to Ni(200), and at the same time make the microscopic distortion of crystal grains smaller. The stronger the magnetic field, the smaller the stress. Ultrasonic cavitation has no obvious effect on the texture, but it will reduce the microscopic distortion of the crystal grains and reduce the tensile stress of the coating. In conslusion, in the nickel sulfamate system, the increase in current density, electroplating time and Cl‒ concentration will significantly increase the tensile stress. The addition of magnetic field and ultrasound reduces the internal stress of the coating while refining the crystal grains.
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