黄嘉乐,王启伟,阳颍飞,王晓明,赵阳,朱胜,李卫.替代电镀铬的碳化硅类复合电镀技术研究进展[J].表面技术,2021,50(1):130-137.
HUANG Jia-le,WANG Qi-wei,YANG Ying-fei,WANG Xiao-ming,ZHAO Yang,ZHU Sheng,LI Wei.Advances in Silicon Carbide Composite Electroplating Technology to Replace Chromium Electroplating[J].Surface Technology,2021,50(1):130-137
替代电镀铬的碳化硅类复合电镀技术研究进展
Advances in Silicon Carbide Composite Electroplating Technology to Replace Chromium Electroplating
投稿时间:2020-03-04  修订日期:2020-05-19
DOI:10.16490/j.cnki.issn.1001-3660.2021.01.010
中文关键词:  电镀铬  SiC  石墨烯  复合电镀  工艺参数
英文关键词:eletrodeposited chromium  SiC  GO  composite plating  technological parameter  development
基金项目:国家重点研发计划项目(2018YFB2002000)
作者单位
黄嘉乐 暨南大学 先进耐磨蚀及功能材料研究院,广州 510632 
王启伟 暨南大学 先进耐磨蚀及功能材料研究院,广州 510632 
阳颍飞 暨南大学 先进耐磨蚀及功能材料研究院,广州 510632 
王晓明 陆军装甲兵学院 再制造技术国家重点实验室,北京 100072 
赵阳 陆军装甲兵学院 再制造技术国家重点实验室,北京 100072 
朱胜 陆军装甲兵学院 再制造技术国家重点实验室,北京 100072 
李卫 暨南大学 先进耐磨蚀及功能材料研究院,广州 510632 
AuthorInstitution
HUANG Jia-le Institute of Advanced Abrasion and Functional Materials, Jinan University, Guangzhou 510632, China 
WANG Qi-wei Institute of Advanced Abrasion and Functional Materials, Jinan University, Guangzhou 510632, China 
YANG Ying-fei Institute of Advanced Abrasion and Functional Materials, Jinan University, Guangzhou 510632, China 
WANG Xiao-ming State Key Laboratory of Remanufacturing Technology, Army Academy of Armored Forces, Beijing 100072, China 
ZHAO Yang State Key Laboratory of Remanufacturing Technology, Army Academy of Armored Forces, Beijing 100072, China 
ZHU Sheng State Key Laboratory of Remanufacturing Technology, Army Academy of Armored Forces, Beijing 100072, China 
LI Wei Institute of Advanced Abrasion and Functional Materials, Jinan University, Guangzhou 510632, China 
摘要点击次数:
全文下载次数:
中文摘要:
      针对目前工业应用中对替代电镀铬工艺的绿色表面技术需求,介绍了物理气相沉积、热喷涂、冷喷涂、超高速激光熔覆、复合电镀技术的原理、特点、应用,以及替代电镀铬工艺的优势和局限性,重点对碳化硅类材料复合镀技术的研究进展进行了综述,介绍了Ni-SiC、Cu-SiC、Zn-SiC、Ni-P-SiC、Ni-SiC-GO镀层的主要应用,及电解液组分中添加石墨烯和氧化石墨烯以提高复合镀层腐蚀性能的作用和机理。介绍了电解液pH值、温度、浓度对镀层性能的影响,不同的电解液体系中,当pH值、温度、浓度达到最优值时,镀层性能可达到最佳。介绍了SiC颗粒尺寸以及分散方式对镀层性能的影响,颗粒尺寸过小,易发生团聚,颗粒尺寸过大,沉积量降低,通过添加剂和物理搅拌,可以有效解决颗粒团聚的问题,提高颗粒沉积量,从而改善镀层性能。介绍了电源参数对复合镀层性能的影响,复合镀工艺中应当优化电流密度、电模式(脉冲和直流)和占空比等参数。最后,总结了碳化硅类材料复合镀技术的发展趋势,即工艺设计向绿色环保化、镀液体系向多元复合化、工艺控制向智能化方向发展。
英文摘要:
      In view of the current green surface technology requirements for alternative electroplating chromium technology in industrial applications, the work reviewed the principles, characteristics and applications of physical vapor deposition, thermal spraying, cold spraying, ultra-high speed laser cladding, and composite electroplating technology, as well as advantages and limitations, focusing on the research progress of silicon carbide composite coating technology; the main applications of Ni-SiC, Cu-SiC, Zn-SiC, Ni-P-SiC, and Ni-SiC-GO coatings; the effect and mechanism of the addition of graphene and graphene oxide to the electrolyte components to improve the corrosion performance of composite coatings; the effects of electrolyte pH value, temperature, and concentration on the performance of the coating (The pH value and temperature in different electrolyte systems were different. When the concentration reached the optimal value, the coating performance can reach the best.); the influence of SiC particle size and dispersion method on the performance of the coating (If the particle size was too small, it was easy to agglomerate, if the particle size was too large, and the deposition amount was reduced. Additive and physical agitation can effectively solve the problem of particle agglomeration and increase the amount of particle deposition, thereby improving the coating performance; the influence of power parameters on composite coating (In the composite plating process, parameters such as current density, electrical mode (pulse and DC), and duty cycle should be optimized). Finally, the work summarized the development trend of silicon carbide composite plating technology, that is, the process design is going green. The plating solution system is diversified and the process control is developed towards intelligence.
查看全文  查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第20058723位访问者    渝ICP备15012534号-3

版权所有:《表面技术》编辑部 2014 surface-techj.com, All Rights Reserved

邮编:400039 电话:023-68792193传真:023-68792396 Email: bmjs@surface-techj.com

渝公网安备 50010702501715号