安俊杰,魏秋平,叶文涛,张龙,包胜友,李崧博,于杨磊,周科朝,马莉,尹登峰.泡沫铜表面改性对化学气相沉积高质量泡沫金刚石的影响[J].表面技术,2020,49(3):97-105.
AN Jun-jie,WEI Qiu-ping,YE Wen-tao,ZHANG Long,BAO Sheng-you,LI Song-bo,YU Yang-lei,ZHOU Ke-chao,MA Li,YIN Deng-feng.High Quality Diamond Films Deposited on Surface Modified Cu Foams by Chemical Vapor Deposition Method[J].Surface Technology,2020,49(3):97-105 |
| 泡沫铜表面改性对化学气相沉积高质量泡沫金刚石的影响 |
| High Quality Diamond Films Deposited on Surface Modified Cu Foams by Chemical Vapor Deposition Method |
| 投稿时间：2019-12-20 修订日期：2020-03-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2020.03.012 |
| 中文关键词: 泡沫铜 过渡层 界面结合 热丝化学气相沉积 泡沫金刚石 热扩散 |
| 英文关键词:Cu foams interlayer interfacial bonding HFCVD diamond foams thermal diffusion |
| 基金项目:国家重点研发计划（2016YFB0301402）；国家自然科学基金（51874370，51601226） |
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| Author | Institution |
| AN Jun-jie | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
| WEI Qiu-ping | a.School of Materials Science and Engineering, b.State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
| YE Wen-tao | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
| ZHANG Long | b.State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
| BAO Sheng-you | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
| LI Song-bo | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
| YU Yang-lei | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
| ZHOU Ke-chao | b.State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
| MA Li | b.State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, China |
| YIN Deng-feng | a.School of Materials Science and Engineering, Central South University, Changsha 410083, China |
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| 中文摘要: |
| 目的 选择合适的过渡层材料改善三维连通泡沫铜衬底与金刚石之间的结合性，制备出三维连通结构的泡沫金刚石。方法 选择三维连通的泡沫铜作为衬底，使用磁控溅射技术在其表面沉积Ti、Cr过渡层，然后通过热丝化学气相沉积技术（HFCVD）在表面改性后的泡沫铜衬底上沉积金刚石涂层。通过扫描电子显微镜（SEM）、能谱分析仪（EDS）、拉曼光谱仪及红外热成像仪等仪器，对样品的表面/截面形貌、成分结构及热扩散性能进行检测与分析。结果 经过Ti、Cr过渡层改性后，泡沫铜表面均能沉积出连续致密的高质量金刚石涂层，在相同的CVD沉积参数下，Cr过渡层泡沫金刚石（Cu-Cr/Dia）的晶粒尺寸更大（~5 μm），晶粒质量更高，且膜层厚度大于Ti过渡层泡沫金刚石（Cu-Ti/Dia），Cu-Ti/Dia与铜衬底的结合性要优于Cu-Cr/Dia。Cu-Cr/Dia和Cu-Ti/Dia的热扩散性能均优于泡沫铜，其中Cu-Cr/Dia的热扩散能力略高于Cu-Ti/Dia。结论 镀覆Ti、Cr过渡层有效增强了金刚石与泡沫铜衬底之间的界面结合，成功制备了三维连通结构的泡沫金刚石。 |
| 英文摘要: |
| The work aims to select suitable interlayers to improve the bonding between the three-dimensional connected Cu foams and diamond, thereby preparing three-dimensional connected diamond foams. The three-dimensional connected Cu foams were selected as the template for the preparation of diamond foams. Ti and Cr interlayers were deposited on the surface of Cu foams by magnetron sputtering, and then the diamond films were deposited by hot filament chemical vapor deposition (HFCVD). The morphology, structure and thermal diffusion performance were measured by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), Raman spectroscopy, X-ray diffraction (XRD) and infrared thermal imaging camera. The continuous diamond films are deposited on the Cu foams successfully after coating Cr and Ti interlayers. Under the same CVD deposition paraments, the Cr-modified Cu/Diamond (Cu-Cr/Dia) have larger grain size (5 μm), higher diamond quality and thicker diamond films compared with Ti-modified Cu/Diamond (Cu-Ti/Dia). The interfacial bonding between diamond and copper substrate of Cu-Ti/Dia samples are better than that of Cr-modified samples. And the thermal diffusion properties of Cu-Cr/Dia and Cu-Ti/Dia samples are both better than Cu foam. Cu-Cr/Dia samples have a slightly faster thermal responding than Cu-Ti/Dia samples. The introduction of Cr and Ti interlayers could effectively enhance the interfacial bonding between diamond and Cu foams, thereby the three-dimensional connected diamond foams were prepared successfully, which have potential applications in thermal management, water treatment, electrochemical sensing and other fields. |
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