熊林利,黎学明,王涛,徐珂.尼龙66复合镀电磁屏蔽织物[J].表面技术,2020,49(1):180-186.
XIONG Lin-li,LI Xue-ming,WANG Tao,XU Ke.Electromagnetic Shielding Fabric of Nylon 66 Composite Plating[J].Surface Technology,2020,49(1):180-186 |
| 尼龙66复合镀电磁屏蔽织物 |
| Electromagnetic Shielding Fabric of Nylon 66 Composite Plating |
| 投稿时间：2019-02-21 修订日期：2020-01-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2020.01.021 |
| 中文关键词: 粗化 化学镀铜 复合镀 电磁屏蔽 尼龙66 织物 |
| 英文关键词:etching electroless copper plating composite plating electromagnetic shielding Nylon 66 fabric |
| 基金项目:中央高校基本科研业务费专项资金项目（2018CDGFHG0012） |
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| 中文摘要: |
| 目的 探究尼龙66化学镀最佳粗化工艺，优化次亚磷酸钠化学镀铜工艺，比较在相同工艺条件下化学镀镍-铜及化学镀铜-镍工艺对织物电磁屏蔽效能的影响。方法 将经过稀盐酸/乙酸水溶液以及稀盐酸/乙酸乙醇溶液粗化后的尼龙66织物化学镀镍，用扫描电镜观察镀层效果，对比两种粗化方案，用化学镀铜沉积速率及质量损失率反映化学镀镀覆效果，探索出次亚磷酸钠的最佳镀铜配方，确定次亚磷酸钠化学镀铜的最佳工艺条件。用法兰同轴测试化学镀铜、化学镀镍及经过化学镀镍后镀铜和化学镀铜后镀镍的电磁屏蔽效能。结果 稀盐酸/乙酸水溶液粗化后，织物镀层易脱落；稀盐酸/乙酸乙醇溶液粗化后，镀层覆着力强。以次亚磷酸钠为还原剂的最佳镀铜工艺为：硫酸铜 20 g/L，硫酸镍8 g/L，次亚磷酸钠 70 g/L，硼酸35 g/L，pH 10.2~10.6，时间 20 min，温度75 ℃。化学镀铜后化学镀镍得到的织物屏蔽效能达70 dB。结论 稀盐酸/乙酸乙醇溶液粗化效果最佳，比使用稀盐酸/乙酸水溶液处理的镀层更均匀致密。化学镀镍所得镀层为非晶态物质，次亚磷酸钠化学镀铜所得镀层为晶态物质。化学镀铜后镀镍织物镀层更为致密。在相同工艺条件下，化学镀铜-镍的质量增加率大于化学镀镍-铜，屏蔽效果优于化学镀铜、化学镀镍-铜。 |
| 英文摘要: |
| The aim of this research is to explore the best etching process for electroless plating, optimize the sodium hypophosphite electroless copper plating process and compare the effects of electroless nickel-copper plating and electroless copper- nickel plating under the same process conditions on the electromagnetic shielding effectiveness of fabric. The electroless nickel plating of nylon 66 after being roughed by dilute hydrochloric acid/acetic acid aqueous solution and dilute hydrochloric acid/acetic acid ethanol solution was observed for effect with SEM to compare the two kinds of etching schemes. The copper plating deposition rate and weight loss rate were used to reflect the effect of the electroless plating to explore the optimal copper plating formula and determine the optimum process conditions for electroless copper plating of sodium hypophosphite. The electromagnetic shielding properties of electroless nickel plating, electroless copper plating, electroless copper plating after nickel plating and electroless nickel plating after copper plating were tested through the flange coaxial test method. After being coarsened with the crude hydrochloric acid/acetic acid aqueous solution, the fabric coating layer was easy to fall off, and the plating coarsended with diluted hydrochloric acid/acetic acid aqueous solution had strong adhesive force. The best copper plating process with sodium hypophosphite as reducing agent was copper sulfate 20 g/L, nickel sulfate 8 g/L, sodium hypophosphite 70 g/L, boric acid 35 g/L, pH 10.2~10.6, time 20 min, temperature 75 ℃. Electroless nickel plating after electroless copper plating gave a fabric shielding effectiveness of 70 dB. The plating treated with dilute hydrochloric acid/acetic acid aqueous solution. The plating obtained by electroless nickel plating is an amorphous substance, and the electroless copper plating of sodium hypophosphite is a crystalline substance. After electroless copper plating, the nickel-plated fabric is more densely plated. Under the same process conditions, the weight gain rate of electroless copper-nickel plating is greater than that of electroless nickel-copper plating, and the electroless copper-nickel shielding effect is superior to electroless copper plating and electroless nickel-copper plating. |
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