吴道新,王毅玮,肖忠良,杨荣华,姚文娟.复合还原剂SHP和HAS对Ni-P表面还原镀金的影响[J].表面技术,2019,48(10):301-308.
WU Dao-xin,WANG Yi-wei,XIAO Zhong-liang,YANG Rong-hua,YAO Wen-juan.Effects of Compound Reducing Agents SHP and HAS on Electroless Gold Plating on Ni-P Surface[J].Surface Technology,2019,48(10):301-308 |
| 复合还原剂SHP和HAS对Ni-P表面还原镀金的影响 |
| Effects of Compound Reducing Agents SHP and HAS on Electroless Gold Plating on Ni-P Surface |
| 投稿时间：2019-03-04 修订日期：2019-10-20 |
| DOI：10.16490/j.cnki.issn.1001-3660.2019.10.037 |
| 中文关键词: 化学镀镍 还原镀金 镀金层 还原剂 成核机理 耐蚀性 |
| 英文关键词:electroless nickel plating electroless gold plating Au layer reducing agent nucleation mechanism corrosion resistance |
| 基金项目:国家工业信息化部、财经部绿色制造系统集成项目；长沙市科技计划项目（Kq1706063） |
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| Author | Institution |
| WU Dao-xin | School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410014, China |
| WANG Yi-wei | School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410014, China |
| XIAO Zhong-liang | School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410014, China |
| YANG Rong-hua | School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410014, China |
| YAO Wen-juan | School of Chemistry and Biological Engineering, Changsha University of Science and Technology, Changsha 410014, China |
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| 中文摘要: |
| 目的 研究复合还原剂次亚磷酸钠（SHP）和硫酸羟胺（HAS）对置换镀金过程的影响，拟解决化学镀Ni-P层上置换镀金的镍腐蚀和后期沉金困难的问题。方法 采用连续加热测试，研究了还原剂对镀液稳定性的影响。利用密度泛函理论对配合物分子进行了计算，对比了反应前后配合物分子结构的福井函数和轨道能级。通过XRF测试了金层的厚度，并结合开路电位分析了还原剂对镀层厚度的影响。利用恒电位下电流瞬变对金核生成和成长的影响进行了分析。通过SEM对镀层的微观形貌进行了表征；通过Tafel测试对镀层的电化学抗腐蚀性进行了分析。结果 次亚磷酸钠和硫酸羟胺同时加入不会影响镀液的稳定性，羟胺与腈根的反应降低了Au+的反应活性。0.05 mol/L次亚磷酸钠和0.03 mol/L硫酸羟胺下能够获得超过0.09 μm的镀金层。在次亚磷酸钠的作用下，镀金过程中的镍析出减少，镍层的腐蚀得到有效抑制。成核模式在硫酸羟胺的作用下处于瞬时成核，金核尺寸更大。镍腐蚀的减少以及镀金层厚度的增加，使得整个镀层的抗腐蚀性能得到显著的提高。结论 在置换镀金液中同时加入次亚磷酸钠和硫酸羟胺有效地提升了镀金速率，并且降低了镍层腐蚀，改善了化学镀镍金层的质量，有利于提高工业生产效率，并满足PCB高致密性和高频化趋势下的新要求。 |
| 英文摘要: |
| The work aims to study the effect of the reducing agents like sodium hypophosphite (SHP) and hydroxyl sulfate (HAS) on immersion gold-plating, so as to solve the problems of corrosion and difficult deposition in late period of immersion gold-plating on Ni-P layer. The effects of reducing agents on stability of plating bath were studied by continuous heating test. The molecules of compounds were calculated by density functional theory, and the Fukui function and orbital energy level were compared before and after the reaction. Au thickness was tested by XRF, and the effects of reducing agents on plating thickness were analyzed in combination with open circuit potential (OCP). The effects of current transients on nucleation mechanism and growth of Au deposition were analyzed under constant potentials. Micro-topography of plating was characterized by SEM. Tafel test was used to analyze the electrochemical corrosion resistance of layers. The simultaneous addition of SHP and HAS did not affect the stability of plating bath, and the production of amidoxime groups reduced the reactivity of Au+. The thickness of Au layer exceeded 0.09 μm under 0.05 mol/L SHP and 0.03 mol/L HAS. Under the action of SHP, the precipitation of Ni in the gold plating process was reduced, and the corrosion of the Ni layer was effectively suppressed. The nucleation mode turned to instantaneous nucleation after the addition of HAS and the size of the Au grain became larger. The reduction of Ni corrosion and the increase in the thickness of Au layer greatly improved the corrosion resistance of the entire coating. The addition of SHP and HAS increases Au deposition rate and suppresses Ni corrosion, thus improving quality of Ni-Au layer, increasing industrial production efficiency and meeting the new requirements on high density and high frequency of PCB. |
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